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RESEARCH PAPER

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

[+] Author and Article Information
Changqing Liu, Paul Conway, Dezhi Li

Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK  

Michael Hendriksen

Manufacturing Technology Group, Celestial Limited, West Avenue, Kids Grove, Stoke-on-Trent, Staffordshire, ST7 1TL, UK

J. Electron. Packag 126(3), 359-366 (Oct 06, 2004) (8 pages) doi:10.1115/1.1773391 History: Received September 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

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Balkan, H., D. Patterson, et al., 2002, “Flip-chip Reliability: Comparative Characterization of Lead Free (Sn/Ag/Cu) and 63Sn/Pb Eutectic Solder,” Proceedings of the 52nd Electronic Components & Technology Conference, New York, IEEE, pp. 1263–1269.
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Figures

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Reflow profile for lead free Sn-Ag-Cu solder paste deposits
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Lead free Sn-Ag-Cu solder bump formed after reflow of paste deposit
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Arrangement and shear tool geometry for micro-shear testing of solder bumps
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Diamond probe geometries for nanoindentation testing
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Schematic of the NanoTest 600 machine of Micromaterials
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Schematic cross-section of depth profile in an indentation on material surface
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Schematic of load vs displacement in nano-indentation testing
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SEM micrographs showing the nano indentation marks across the lead free Sn-Ag-Cu joints: (a) no aging; (b) aged at 150°C for 7 days
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Nano indentation results prior to aging: (a) indentation depth profile; (b) hardness and elastic modulus profile
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Nano indentation results after aging at 80°C for 7 days: (a) indentation depth profile; (b) hardness and elastic modulus profile
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Nano indentation results of Line 1 in Fig. 8(b) after 7 days aging at 150°C: (a) indentation depth profile; (b) hardness and elastic modulus profile
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Hardness and elastic modulus profile of Line 2 in Fig. 8(b)
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SEM/EDX observation of Ag3Sn intermetallics along the Ni-P/Sn-Ag-Cu interface
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SEM/EDX analysis of the indentations in Sn-Ag-Cu solder joints with IMCs formed

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