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RESEARCH PAPER

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

[+] Author and Article Information
Bart Vandevelde, Eric Beyne

IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

Dirk Vandepitte, Martine Baelmans

Catholic University of Leuven, Celestijnenlaan 300B, B-3001 Leuven, Belgium

J. Electron. Packag 126(3), 351-358 (Oct 06, 2004) (8 pages) doi:10.1115/1.1772416 History: Received July 01, 2003; Revised January 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Figures

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Principle of the analytical calculations for the thermo-mechanical model
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Schematic drawing of the area array thermo-mechanical model
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Forces acting between the components 1, 2, and the n joints
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Internal forces acting on the components and joints
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Magnified view of the deformations U1,U2,Uc+ and Uc
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Internal load distribution in the joint (bjoint=out-of-plane joint thickness)
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Normal and shear stresses caused by forces F and N and moments Mc1 and Mc2
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Normal and shear stresses caused by local thermal mismatches
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2D plain strain FEM for a 25×25 area array chip assembled to an alumina carrier. The plain strain elements have also an out-of plane thickness which is 0.1 mm for the joint elements and 0.2 mm (=pitch) for the chip and alumina elements.
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Warpage of chip and alumina components calculated by the analytical model and by FEM (warpage in neutral fibre of the components)
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Forces and moments acting on the area array joints (analytical model)
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Forces and moments acting in the different sections of the top and bottom component (analytical model)
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Effect of h2 on the edge joint forces N and F (p=0.2 mm, 25×25 area array)
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Effect of joint height hc. The force F is decreasing with increasing hc, but the joint moments Mc1,2 are dependent on the product of F and hc. (At small hc, the FEM results are not following the stress rise calculated by the analytical model. As a fixed element size is chosen, the element stress is almost the average stress over the whole small joint.
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Numbering of the elements in the area array model
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Maximum Von Mises stress in each joint of a 25×25 area array flip chip assembly (calculated by FEM and analytical model)
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Maximum σVM in each joint of an area array assembly with different array sizes

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