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RESEARCH PAPER

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

[+] Author and Article Information
Duckjong Kim

Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea

Sung Jin Kim

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea

Alfonso Ortega

Department of Aerospace and Mechanical Engineering, The Center for Electronics Packaging Research, University of Arizona, Tucson, AZ 85721

J. Electron. Packag 126(3), 342-350 (Oct 06, 2004) (9 pages) doi:10.1115/1.1772415 History: Received October 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Sparrow,  E. M., Ramsey,  J. W., and Altemani,  C. A. C., 1980, “Experiments on In-Line Pin Fin Arrays and Performance Comparisons With Staggered Arrays,” ASME J. Heat Transfer, 102, pp. 44–50.
Chyu,  M. K., Hsing,  Y. C., and Natarajan,  V., 1998, “Convective Heat Transfer of Cubic Fin Arrays in a Narrow Channel,” ASME J. Heat Transfer, 120, pp. 362–367.
Shaukatullah, H., Storr, W. R., Hansen, B. J., and Gaynes, M. A., 1996, “Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications,” Proc. Int. Electronics Packaging Conference, pp. 486–494.
Josson, H., and Moshfegh, B., 2000, “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks—Influence of Flow Bypass,” Proc. Int. Electronics Packaging Conference, pp. 185–192.
Sparrow,  E. M., Baliga,  B. R., and Patankar,  S. V., 1978, “Forced Convection Heat Transfer From a Shrouded Fin Array With and Without Tip Clearance,” ASME J. Heat Transfer, 100, pp. 572–579.
Ryu, H. C., Kim, D., and Kim, S. J., 2002, “Experimental Analysis of Shrouded Pin Fin Heat Sinks for Electronic Equipment Cooling,” Proc. ITherm Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 261–266.
Koh,  J. C. Y., and Colony,  R., 1986, “Heat Transfer of Microstructures for Integrated Circuits,” Int. Comm. Heat Mass Transfer ,13, pp. 89–98.
Tuckerman, D. B., 1984, “Heat-Transfer Microstructures for Integrated Circuits,” Ph.D. thesis, Stanford University.
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You,  H. I., and Chang,  C. H., 1997, “Numerical Prediction of Heat Transfer Coefficient for a Pin-Fin Channel Flow,” ASME J. Heat Transfer, 119, pp. 840–843.
Kim,  D., and Kim,  S. J., 2004, “Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks,” ASME J. Electron. Packag., 126 .
Bejan, A., 1995, Convection Heat Transfer, John Wiley and Sons, New York.
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Zhukauskas, A., 1972, “Heat Transfer From Tubes in Cross Flow,” J. P. Hartnett and T. F. Irvine, Jr., eds., Advances in Heat Transfer, Vol. 9, Academic Press, New York.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corp., New York.
Blevins, R. D., 1992, Applied Fluid Dynamics Handbook, Krieger Publishing Company, Malabar.
Shah,  R. K., 1978, “A Correlation for Laminar Hydrodynamic Entry Length Solutions for Circular and Noncircular Ducts,” ASME J. Fluids Eng., 100, pp. 177–179.
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Sparrow,  E. M., and Grannis,  V. B., 1991, “Pressure Drop Characteristics of Heat Exchangers Consisting of Arrays of Diamond-Shaped Pin Fins,” Int. J. Heat Mass Transfer, 34, pp. 589–600.

Figures

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Porous medium approach: (a) forced convective flow through a pin fin heat sink; (b) equivalent porous medium
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Nusselt number for pin fin heat sinks
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Three divided regions for pressure calculation
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Scaled-up pin fin heat sink (εx=0.6,εz=0.6,H=20 (mm))
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Test sections: (a) pressure measurement; (b) temperature measurement
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Pressure distributions inside pin fin heat sinks
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Heat transfer in the heat sink base: (a) heatlines; (b) heat flux distribution (εx=0.4,εz=0.4,vin=5 (m/s))
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Pressure distributions inside pin fin heat sinks: (a) εx=0.2,εz=0.2; (b) εx=0.4,εz=0.4; (c) εx=0.6,εz=0.6; (d) εx=0.8,εz=0.8 (vin=1 (m/s))
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Temperature distributions at the bottom of pin fin heat sinks: (a) εx=0.2,εz=0.2; (b) εx=0.8,εz=0.8 (vin=1 (m/s))
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Effect of surface porosities on total thermal resistance of a heat sink: (a) conventional pin fin heat sinks; (b) microstructures of pin fin shape
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Thermal performance of heat sinks presented by Jonsson and Moshfegh 4

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