Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

[+] Author and Article Information
Duckjong Kim

Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea

Sung Jin Kim

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea

Alfonso Ortega

Department of Aerospace and Mechanical Engineering, The Center for Electronics Packaging Research, University of Arizona, Tucson, AZ 85721

J. Electron. Packag 126(3), 342-350 (Oct 06, 2004) (9 pages) doi:10.1115/1.1772415 History: Received October 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.


Sparrow,  E. M., Ramsey,  J. W., and Altemani,  C. A. C., 1980, “Experiments on In-Line Pin Fin Arrays and Performance Comparisons With Staggered Arrays,” ASME J. Heat Transfer, 102, pp. 44–50.
Chyu,  M. K., Hsing,  Y. C., and Natarajan,  V., 1998, “Convective Heat Transfer of Cubic Fin Arrays in a Narrow Channel,” ASME J. Heat Transfer, 120, pp. 362–367.
Shaukatullah, H., Storr, W. R., Hansen, B. J., and Gaynes, M. A., 1996, “Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications,” Proc. Int. Electronics Packaging Conference, pp. 486–494.
Josson, H., and Moshfegh, B., 2000, “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks—Influence of Flow Bypass,” Proc. Int. Electronics Packaging Conference, pp. 185–192.
Sparrow,  E. M., Baliga,  B. R., and Patankar,  S. V., 1978, “Forced Convection Heat Transfer From a Shrouded Fin Array With and Without Tip Clearance,” ASME J. Heat Transfer, 100, pp. 572–579.
Ryu, H. C., Kim, D., and Kim, S. J., 2002, “Experimental Analysis of Shrouded Pin Fin Heat Sinks for Electronic Equipment Cooling,” Proc. ITherm Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 261–266.
Koh,  J. C. Y., and Colony,  R., 1986, “Heat Transfer of Microstructures for Integrated Circuits,” Int. Comm. Heat Mass Transfer ,13, pp. 89–98.
Tuckerman, D. B., 1984, “Heat-Transfer Microstructures for Integrated Circuits,” Ph.D. thesis, Stanford University.
You,  H. I., and Chang,  C. H., 1997, “Determination of Flow Properties in Non-Darcian Flow,” ASME J. Heat Transfer, 119, pp. 190–192.
You,  H. I., and Chang,  C. H., 1997, “Numerical Prediction of Heat Transfer Coefficient for a Pin-Fin Channel Flow,” ASME J. Heat Transfer, 119, pp. 840–843.
Kim,  D., and Kim,  S. J., 2004, “Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks,” ASME J. Electron. Packag., 126 .
Bejan, A., 1995, Convection Heat Transfer, John Wiley and Sons, New York.
Kaviany, M., 1995, Principles of Heat Transfer in Porous Media, Springer-Verlag, New York.
Slattery, V. C., 1999, Advanced Transport Phenomena, Cambridge University Press, Cambridge, pp. 194–197.
Masuoka,  T., and Takatsu,  Y., 1997, “Authors’ Reply,” Int. J. Heat Mass Transfer, 40, pp. 2499–2500.
Zhukauskas, A., 1972, “Heat Transfer From Tubes in Cross Flow,” J. P. Hartnett and T. F. Irvine, Jr., eds., Advances in Heat Transfer, Vol. 9, Academic Press, New York.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corp., New York.
Blevins, R. D., 1992, Applied Fluid Dynamics Handbook, Krieger Publishing Company, Malabar.
Shah,  R. K., 1978, “A Correlation for Laminar Hydrodynamic Entry Length Solutions for Circular and Noncircular Ducts,” ASME J. Fluids Eng., 100, pp. 177–179.
Beckwith, T. G., Marangoni, R. D., and Lienhard, J. H., 1993, Mechanical Measurement, Addison Wesley, New York.
Sparrow,  E. M., and Grannis,  V. B., 1991, “Pressure Drop Characteristics of Heat Exchangers Consisting of Arrays of Diamond-Shaped Pin Fins,” Int. J. Heat Mass Transfer, 34, pp. 589–600.


Grahic Jump Location
Heat transfer in the heat sink base: (a) heatlines; (b) heat flux distribution (εx=0.4,εz=0.4,vin=5 (m/s))
Grahic Jump Location
Pressure distributions inside pin fin heat sinks: (a) εx=0.2,εz=0.2; (b) εx=0.4,εz=0.4; (c) εx=0.6,εz=0.6; (d) εx=0.8,εz=0.8 (vin=1 (m/s))
Grahic Jump Location
Temperature distributions at the bottom of pin fin heat sinks: (a) εx=0.2,εz=0.2; (b) εx=0.8,εz=0.8 (vin=1 (m/s))
Grahic Jump Location
Effect of surface porosities on total thermal resistance of a heat sink: (a) conventional pin fin heat sinks; (b) microstructures of pin fin shape
Grahic Jump Location
Thermal performance of heat sinks presented by Jonsson and Moshfegh 4
Grahic Jump Location
Porous medium approach: (a) forced convective flow through a pin fin heat sink; (b) equivalent porous medium
Grahic Jump Location
Nusselt number for pin fin heat sinks
Grahic Jump Location
Three divided regions for pressure calculation
Grahic Jump Location
Scaled-up pin fin heat sink (εx=0.6,εz=0.6,H=20 (mm))
Grahic Jump Location
Test sections: (a) pressure measurement; (b) temperature measurement
Grahic Jump Location
Pressure distributions inside pin fin heat sinks



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In