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RESEARCH PAPER

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

[+] Author and Article Information
Hiroshi Honda, Nobuo Takata

Institute for Materials Chemistry and Engineering, Kyushu University, Kasuga 816-8580, Japan

ZhengGuo Zhang

Chemical Engineering Research Institute, South China University of Technology, Guangzhou 510640, China

J. Electron. Packag 126(3), 317-324 (Oct 06, 2004) (8 pages) doi:10.1115/1.1772412 History: Received November 01, 2003; Revised January 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Figures

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SEM images of chips PF50-190 (tf≃44 μm,hf≃190 μm) and PF50-270 (tf≃41 μm,hf≃270 μm)
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Variation of W with Q,s=10 mm
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Relation between ΔP and W,s=10 mm
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Flow conditions in the vertical tube plotted on the Hewitt and Roberts map for vertical upflow
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Variation of ΔW with W,s=10 mm
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Boiling phenomena; Chip PF50-270, ΔTsub=25 K,s=10 mm
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Effects of ΔTsub and W on boiling curve, Chip S, s=10 mm
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Effects of ΔTsub and W on boiling curve, Chip PF50-190, s=10 mm
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Effect of ΔTsub on boiling curve, comparison of chips PF50-190 and PF50-270, s=10 mm
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Comparison of boiling curves for different chips; H=250 mm,h=60 mm,W=150 g/min,ΔTsub=35 K
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Comparison of boiling curves for different duct height; chip PF100-150, ΔTsub=25 K
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Comparison of boiling curves between natural circulation loop and pool boiling; ΔTsub=25 K;H=450 mm,h=200 mm,W=1500 g/min, and s=10 mm for natural circulation loop
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Variation of qmax with ΔTsub, effect of duct height
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Variation of qmax with ΔTsub, comparison between natural circulation loop with s=10 mm and pool boiling

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