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RESEARCH PAPER

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

[+] Author and Article Information
Shankar Krishnan, Suresh V. Garimella

Cooling Technologies Research Center, Purdue University, West Lafayette, Indiana 47907-2088

J. Electron. Packag 126(3), 308-316 (Oct 06, 2004) (9 pages) doi:10.1115/1.1772411 History: Received June 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Figures

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Interface locations as a function of time for different Stefan numbers
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Predicted thermal resistance as a function of time for the different materials considered, for a 300 W heat input for 50 s. In the inset, triacontane is omitted to distinguish between the much lower resistances of the other materials.
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Junction temperature as a function of time in the copper heat sink
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Junction temperature during cooling of the copper heat sink as a function of time (after the end of the 600 W pulse input for 25 s)
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 600 W
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Temperature variation at the mid-height (y=35 mm) for different pulses, at the end of the respective pulse input periods
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Temperature variation at the mid-height (y=35 mm) at different times for triacontane for an input pulse of 600 W, with (a) PCM alone, and (b) PCM with aluminum foam
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Predicted junction temperature as a function of time during cooling (melting and resolidification) for the Bi/Sn/In alloy PCM. The inset shows the detailed behavior at small times.
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Predicted temperature distribution at 50 s for a 300 W pulse input at the mid-height (y=35 mm) for copper heat sink, Bi/Pb/Sn/In and Bi/Sn/In alloys and organic PCM with a metal foam
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Predicted temperature distribution at 25 s for a 600 W pulse input at the mid-height (y=35 mm) for copper heat sink, Bi/Pb/Sn/In and Bi/Sn/In alloys and organic PCM with a metal foam
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Schematic diagram of the problem considered

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