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RESEARCH PAPER

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

[+] Author and Article Information
Shankar Krishnan, Suresh V. Garimella

Cooling Technologies Research Center, Purdue University, West Lafayette, Indiana 47907-2088

J. Electron. Packag 126(3), 308-316 (Oct 06, 2004) (9 pages) doi:10.1115/1.1772411 History: Received June 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Evans,  A. G., He,  M. Y., Hutchinson,  J. W., and Shaw,  M., 2001, “Temperature Distribution in Advanced Power Electronics Systems and the effect of Phase Change Materials on Temperature Suppression during Power Pulses,” ASME J. Electron. Packag., 123, pp. 211–217.
Lu,  T. J., 2000, “Thermal Management of High Power Electronics with Phase Change Cooling,” Int. J. Heat Mass Transfer, 43, pp. 2245–2256.
Incropera, F. P., and DeWitt, D. P., 1998, Fundamentals of Heat and Mass Transfer, John Wiley & Sons, New York.
Ishizuka,  M., and Fukuoka,  Y., 1991, “Development of a New High Density Package Cooling Technique Using Low Melting Point Alloys,” Proceedings ASME/JSME Joint Thermal Engineering Conference, 2, pp. 375–380.
Pal,  D., and Joshi,  Y. K., 2001, “Melting in a Side Heated Tall Enclosure by a Uniformly Dissipating Heat Source,” Int. J. Heat Mass Transfer, 44, pp. 375–387.
Krishnan, S., 2002, “Analysis of Phase Change Energy Storage Systems for Pulsed Power Dissipation,” M.S.M.E. Thesis, Purdue University, West Lafayette, Indiana.
Simpson,  J. E., Garimella,  S. V., and de Groh , 2002, “An Experimental and Numerical Investigation of the Bridgman Growth of Succinonitrile,” J. Thermophys. Heat Transfer, 16, pp. 324–335.
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Figures

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Schematic diagram of the problem considered
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Interface locations as a function of time for different Stefan numbers
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Predicted thermal resistance as a function of time for the different materials considered, for a 300 W heat input for 50 s. In the inset, triacontane is omitted to distinguish between the much lower resistances of the other materials.
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Junction temperature as a function of time in the copper heat sink
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Junction temperature during cooling of the copper heat sink as a function of time (after the end of the 600 W pulse input for 25 s)
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 300 W
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Temperature variation at the mid-height (y=35 mm) at different times for an input pulse of 600 W
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Temperature variation at the mid-height (y=35 mm) for different pulses, at the end of the respective pulse input periods
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Temperature variation at the mid-height (y=35 mm) at different times for triacontane for an input pulse of 600 W, with (a) PCM alone, and (b) PCM with aluminum foam
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Predicted junction temperature as a function of time during cooling (melting and resolidification) for the Bi/Sn/In alloy PCM. The inset shows the detailed behavior at small times.
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Predicted temperature distribution at 50 s for a 300 W pulse input at the mid-height (y=35 mm) for copper heat sink, Bi/Pb/Sn/In and Bi/Sn/In alloys and organic PCM with a metal foam
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Predicted temperature distribution at 25 s for a 600 W pulse input at the mid-height (y=35 mm) for copper heat sink, Bi/Pb/Sn/In and Bi/Sn/In alloys and organic PCM with a metal foam

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