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RESEARCH PAPER

Reducing Warpage of Printed Circuit Boards by Using Wavy Traces

[+] Author and Article Information
Parsaoran Hutapea, Joachim L. Grenestedt

Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015

J. Electron. Packag 126(3), 282-287 (Oct 06, 2004) (6 pages) doi:10.1115/1.1756591 History: Received February 01, 2003; Revised February 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

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Grenestedt,  J. L., and Hutapea,  P., 2003, “Influence of Electric Artwork on Thermomechanical Properties and Warpage of Printed Circuit Boards,” J. Appl. Phys., 94(1), pp. 686–696.
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Figures

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Pins 1 and 2 should be connected, as should Pins 3 and 4. In the X-Y routing figure, solid lines are traces within one layer, dashed within another layer
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Models 1a and 1b have bare traces as the top and bottom layers. Models 2a and 2b have copper traces/FR4 layers as the top and bottom layers. Black is copper and white is FR4
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Thermal warpage of the PCB with in-plane wavy traces. The triangles are FE results, and the fine line is a quadratic curve fit
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A volume sketch of periodic boundary conditions. The vertical boundary surfaces are denoted by letters A, B, C and D
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Photo of the manufactured straight and wavy PCB’s
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Warpage versus temperature obtained from the FE analyses and experiments
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Warpage versus temperature obtained from the FE analyses and experiments
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An artwork of a layer of a real production PCB using wavy electric traces

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