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RESEARCH PAPER

The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

[+] Author and Article Information
Samuel I-En Lin

Department of Electric Engineering, Chung-Chou Institute of Technology, Yuan-Lin, Taiwan, Republic of Chinae-mail: Samlin7@ms41.hinet.net

J. Electron. Packag 126(3), 273-281 (Oct 06, 2004) (9 pages) doi:10.1115/1.1756592 History: Received January 01, 2003; Revised January 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

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Figures

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In a thin-film filter based on a three-port DWDM MUX/DEMUX device, the GRIN lens acts to focus the beam while the thin-film filter either pass or reflect individual channels. The GRIN lens and fiber pigtail are packaged in the metal tube using epoxy adhesive.
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The schematic diagram of an MUX/DEMUX interface based filter module
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The schematic diagram of two packaging designs: 4-solder joint and 6 solder joint designs. There is a Z direction offset 0.1 mm in the metal tube. Dimensions of the filter assembly section are also labeled.
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Three-dimensional finite element model of the 4-solder joint (Top) and 6-solder joint (Bottom) geometries. The local re-mesh feature was applied in all solders to ensure the model accuracy. The metal holder has been rotated/shifted in the 6-solder joint model, so the meshed solders can be shown in the figure.
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Simulation of solder solidification (stage 1), thermal aging (stage 2, 100°C) and thermal cycles (region 3, −40°C to 100°C). Stages 2A and 3A represent the outside temperature set to 23°C. All stages are free convection heat transfer process with prescribed room temperature profile. Stage 1 has initial solder melting temperatures and is cool down to room temperature 23°C.
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The ANSYS 4-solder joint element plot. The material properties of the holder and the tube are identical to MARC model. The solder elements are replaced by SUS304L with Young’s modulus 98 N/mm2. Thermal loading is identical to the profile in Fig. 5. (a) The element-plot without solder element (b) another view with the removal of holder elements in the model.
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The deformation contour plot (Z direction only) of ANSYS 4-solder joint model at temperature 100°C
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Thermal residual plastic deformations at points A and B (located in 90 deg) of 4-solder joint model during stages 1,2 and 3A. Only displacements in Z direction were measured since it directly affects the optical path accuracy. Two solders (63Sn37Pb and 80Au20Sn) are used in the solder joints. All solders are stress-free in their respectively melting temperature.
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Major principle stress distribution of metal tube’s circumferential arch length along solder joint (starting from 180 deg to 0 and Z=2.0/2.5/3.5 mm°). The shaded area indicate solder joint. The extracted data are from stage 2 (100°C) and stage 3A (23°C) of 4-solder joint model.
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Displacement in Z direction during thermal cycles (4-solder joint model with 63Sn37Pb solder). Zero initial stress: stress-free at 23°C. With initial stresses: stress-free at solders’ melting temperature.
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Thermal residual plastic deformations at points A and B (located in 90 deg) of 6-solder joint model during stages 1,2 and 3A. Only displacements in Z direction were measured since it directly affects the optical path accuracy. Two solders (63Sn37Pb and 80Au20Sn) are used in the solder joints. All solders are stress-free in their respectively melting temperature.
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The defected solder used in our finite element models. Top: The solder was over-filled in the 0-degree hole and generated a 0.1 mm solder thickness on the metal holder surface. Bottom: The solder was under-filled in the 0-degree hole.
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Thermal residual plastic deformations of defected solder conditions at points A and B (located in 90 deg) during stages 1,2 and 3A. These results are from 4-solder joint model with 63Sn37Pb solders. The experimental results (dots) are from underfilled solder (points A and B) measured during stage 3A only.

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