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TECHNICAL PAPERS

Warpage Analysis of Underfilled Wafers

[+] Author and Article Information
Hai Ding, I. Charles Ume, Cheng Zhang

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 126(2), 265-270 (Jul 08, 2004) (6 pages) doi:10.1115/1.1707036 History: Received October 01, 2001; Revised October 01, 2002; Online July 08, 2004
Copyright © 2004 by ASME
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References

Figures

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Wafer-level flip-chip process
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Half cross-section of an underfilled wafer
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Mesh of 3D solid element
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Deformed shape along with undeformed line frame of Run #2
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A typical shadow moiré setup
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Fringe pattern and surface plot of shadow moiré result of Run #2
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Normal probability plot of the reduced model
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Residuals vs. order of the reduced model

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