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TECHNICAL PAPERS

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

[+] Author and Article Information
Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman

Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 126(2), 256-264 (Jul 08, 2004) (9 pages) doi:10.1115/1.1756150 History: Received March 01, 2003; Online July 08, 2004; Revised January 04, 2012
Copyright © 2004 by ASME
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References

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Cluff, K. D., Bui, D. X., and Barker, D. B., 1998, “Verifying the Temperature Requirements of Electronic Components From Measured Thermal History,” ASME IMECE, Anaheim, CA, November.
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Ju, S. H., Kuskowski, S., Sandor, B., and Plesha, M. E., 1994, “Creep-Fatigue Damage Analysis of Solder Joints,” Fatigue of Electronic Materials, ASTM STP 1153, S. A. Schroeder and M. R. Mitchell, eds., pp. 1–21.
Garofalo, F., 1965, Fundamentals of Creep and Creep-Rupture in Metals, The Macmillan Company, New York, NY.
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Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” Proc. Symp. Design and Reliability of Solders and Solder Interconnections, TMS Annual Meeting, Minerals, Metals & Materials Soc, Orlando, FL, pp. 10–13.
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Pyland,  J., Pucha,  R. V., and Sitaraman,  S. K., 2002, “Thermo-Mechanical Reliability of Underfilled BGA Packages,” IEEE Trans. Electron. Packag. Manufac., 25(2), pp. 100–106.
Dowling, N. E., 1993, Mechanical Behavior of Materials, Prentice Hall, New Jersey.
Classe, F., and Sitaraman, S. K., 2003, “Asymmetric Accelerated Thermal Cycles: An Alternative Approach to Accelerated Reliability Assessment of Microelectronic Packages,” Proceedings of EPTC 2003, 5th Electronics Packaging Technology Conference, IEEE-CPMT and IMAPS, Dec. 10–12, 2003, Singapore, pp. 81–89.
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Figures

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Schematic of SBGA package and sub-components
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Cycles to failure—SBGA 352 (Georgia Tech. Experiments)
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Contours of accumulated inelastic strain in solder for different constitutive models
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Failure site comparison (a) Cross section after accelerated thermal cycling (b) Accumulated strain contour (Modeling)
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Operating thermal conditions
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Diurnal thermal conditions
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Accelerated thermal cycle (Baseline)
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Creep and plastic strain contribution for the baseline ATC
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Creep and plastic strain contribution for the AATC-1
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Creep and plastic strain contribution for the AATC-2
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Creep and plastic strain contribution for the AATC-3

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