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TECHNICAL PAPERS

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

[+] Author and Article Information
Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman

Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 126(2), 256-264 (Jul 08, 2004) (9 pages) doi:10.1115/1.1756150 History: Received March 01, 2003; Online July 08, 2004; Revised January 04, 2012
Copyright © 2004 by ASME
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References

Figures

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Schematic of SBGA package and sub-components
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Cycles to failure—SBGA 352 (Georgia Tech. Experiments)
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Contours of accumulated inelastic strain in solder for different constitutive models
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Failure site comparison (a) Cross section after accelerated thermal cycling (b) Accumulated strain contour (Modeling)
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Operating thermal conditions
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Diurnal thermal conditions
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Accelerated thermal cycle (Baseline)
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Creep and plastic strain contribution for the baseline ATC
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Creep and plastic strain contribution for the AATC-1
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Creep and plastic strain contribution for the AATC-2
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Creep and plastic strain contribution for the AATC-3

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