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TECHNICAL PAPERS

Development of G-Helix Structure as Off-Chip Interconnect

[+] Author and Article Information
Qi Zhu, Lunyu Ma, Suresh K. Sitaraman

Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The Georgia W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405 http://www.me.gatech.edu/caspar

J. Electron. Packag 126(2), 237-246 (Jul 08, 2004) (10 pages) doi:10.1115/1.1756148 History: Received April 01, 2003; Revised January 01, 2004; Online July 08, 2004
Copyright © 2004 by ASME
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References

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Figures

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Effect of thickness of arcuate beam on directional compliance
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Constitutive behaviors of copper and three solder attach materials
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Equivalent plastic strain and von Mises stress distribution of G-helix assembly
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Effect of the post height on directional compliance
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Effect of the mean radius of arcuate beam on directional compliance
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Geometry of G-helix in analytical analysis
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SEM micrograph of G-helix interconnects with electroplated solder bumps
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SEM micrograph of G-helix interconnects
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G-helix fabrication process
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Effect of the width of the arcuate beam on directional compliance
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Effect of the beam radius on self-inductance and resistance
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Effect of the post height on self-inductance and resistance
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Effect of the beam thickness on self-inductance and resistance
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Effect of the beam width on self-inductance and resistance
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Effect of frequency on self-inductance
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Effect of frequency on resistance
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Meshed GPD model of G-helix assembly
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Pitch effect on the mutual inductance of G-helix interconnects
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Pitch size effect on the predicted thermal fatigue life of G-helix package
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Design of G-helix interconnect

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