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TECHNICAL PAPERS

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

[+] Author and Article Information
Chandrakant S. Desai, Zhichao Wang

Copeland Corporation, P.O. Box 669, Sidney, OH 45365-0667

Russell Whitenack, Tribikram Kundu

Department of Civil Engineering and Engineering Mechanics, The University of Arizona, Tucson, AZ 85721-0072

J. Electron. Packag 126(2), 232-236 (Jul 08, 2004) (5 pages) doi:10.1115/1.1756147 History: Received May 01, 2003; Revised January 01, 2004; Online July 08, 2004

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References

Desai,  C. S., Chia,  J., Kundu,  T., and Prince,  J. L., 1997, “Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I and II,” ASME J. Electron. Packag., 119, pp. 209–300, 301–309.
Desai, C. S., 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, Florida.
Desai, C. S., 2001, “Thermomechanical Digital Image Correlation Device (TM-DIC) for Testing Materials and Joints in Electronic Packaging,” Report, Dept. of Civil Eng. and Eng. Mechanics, The Univ. of Arizona, Tucson, AZ.
Wang, Z., 2001, “Disturbed State Constitutive Modeling and Testing of Solders in Electronic Packaging,” Ph.D. Dissertation, Dept. of Civil Eng. and Eng. Mechanics, The University of Arizona, Tucson, AZ.
Desai,  C. S., and Whitenack,  R., 2001, “Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging,” ASME J. Electron. Packag., 123, pp. 1–15.
Shi,  X. Q., Zhou,  W., 1999, “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy,” ASME J. Electron. Packag., 121, pp. 179–185.
Desai, C. S., 2000, “DSC-SST2D—Computer Code for Static, Dynamic, Creep and Thermal Analysis: Solid, Structure and Soil-Structure Problems,” Report, C. S. Desai, Tucson, AZ, USA.
Barker, D. B., Gupta, V. K., and Cluff, K., 1993, “Solder Joint Crack Initiation and Crack Propagation in a TSOP Using Strain Energy Partitioning,” Proc., Advances in Electronic Packaging, ASME, Int. Electronic Packaging Conf., Binghamton, NY, Vol. 4-2, pp. 943–949.
Desai,  C. S., Basaran,  C., Dishongh,  T., and Prince,  J. L., 1998, “Thermomechanical Analysis in Electronic Packaging with Unified Constitutive Model for Materials and Joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 12(1), pp. 87–97.

Figures

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Comparison between variation of Young’s modulus with temperature and strain rates from TM-DIC and Shi and Zhou, 6
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Variation of shear modulus with temperature for different strain rates
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Variation of ultimate shear stress with temperature at different shear strain rates
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Variation of hardening parameters a1 and η1 with temperature for different shear strain rates (a) variation of a1 with temperature (b) variation of η1 with temperature  
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Variation of disturbance parameters A and Z with temperature for different shear strain rates (a) variation of A (b) variation of Z
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Bonding stress, 3R, and variation with T and γ̇ (a) bonding stress 3R in J1−J2D plane (b) variation of bonding stress with temperature for different shear strain rates
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Variation of state change parameter n with temperature for different shear strain rates
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Mesh and predictions for typical stress-strain data (a) FEM mesh for back prediction of test results (b) shear strain rate=2.78×10−2/s,temperature=−20°C (c) shear strain rate=2.78×10−3/s,temperature=25°C (d) shear strain rate=2.78×10−4/s,temperature=125°C
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FEM mesh and TSOP package dimensions
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Development of disturbance with cycles in different elements and for different design disturbance (a) simulation of joint failure using DSC constitutive model (b) observed crack initiation and propagation 8
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Development of disturbance with cycles in different elements and for different design disturbance

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