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TECHNICAL PAPERS

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

[+] Author and Article Information
Chandrakant S. Desai, Zhichao Wang

Copeland Corporation, P.O. Box 669, Sidney, OH 45365-0667

Russell Whitenack, Tribikram Kundu

Department of Civil Engineering and Engineering Mechanics, The University of Arizona, Tucson, AZ 85721-0072

J. Electron. Packag 126(2), 232-236 (Jul 08, 2004) (5 pages) doi:10.1115/1.1756147 History: Received May 01, 2003; Revised January 01, 2004; Online July 08, 2004

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References

Figures

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Comparison between variation of Young’s modulus with temperature and strain rates from TM-DIC and Shi and Zhou, 6
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Variation of shear modulus with temperature for different strain rates
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Variation of ultimate shear stress with temperature at different shear strain rates
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Variation of hardening parameters a1 and η1 with temperature for different shear strain rates (a) variation of a1 with temperature (b) variation of η1 with temperature  
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Variation of disturbance parameters A and Z with temperature for different shear strain rates (a) variation of A (b) variation of Z
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Bonding stress, 3R, and variation with T and γ̇ (a) bonding stress 3R in J1−J2D plane (b) variation of bonding stress with temperature for different shear strain rates
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Variation of state change parameter n with temperature for different shear strain rates
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Mesh and predictions for typical stress-strain data (a) FEM mesh for back prediction of test results (b) shear strain rate=2.78×10−2/s,temperature=−20°C (c) shear strain rate=2.78×10−3/s,temperature=25°C (d) shear strain rate=2.78×10−4/s,temperature=125°C
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FEM mesh and TSOP package dimensions
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Development of disturbance with cycles in different elements and for different design disturbance (a) simulation of joint failure using DSC constitutive model (b) observed crack initiation and propagation 8
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Development of disturbance with cycles in different elements and for different design disturbance

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