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TECHNICAL PAPERS

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

[+] Author and Article Information
Chandrakant S. Desai, Zhichao Wang

Copeland Corporation, P.O. Box 669, Sidney, OH 45365-0667

Russell Whitenack, Tribikram Kundu

Department of Civil Engineering and Engineering Mechanics, The University of Arizona, Tucson, AZ 85721-0072

J. Electron. Packag 126(2), 225-231 (Jul 08, 2004) (7 pages) doi:10.1115/1.1756146 History: Received May 01, 2003; Revised January 01, 2004; Online July 08, 2004

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References

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Figures

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Representations of DSC (a) symbolic representations of DSC (b) disturbance and cyclic behavior
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Details of TM-DIC device (a) front view of the device (b) internal details with heating and cooling units
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Sample and loading pattern (a) sample (b) loading pattern
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Sample preparation device and vacuum chamber
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Interfacial damage of solder joint by using DIC
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Effect of normal load (NL) on stress behavior under two temperatures and γ̇=2.78×10−2/s
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Responses at different temperatures at strain rate=2.78×10−2/s
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Effect of rate dependence for T=25°C and 125°C (a) temperature=25°C (b) temperature=125°C
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Creep response at different constant shear stresses; temperature=20°C, normal load=1.0 lb
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Isothermal fatigue tests at T=−20°C,γ̇=2.78×10−4/s,γmax=0.0394 (a) applied shear strain vs. time for typical cycle (b) measured shear stress vs. time for a typical cycle (c) shear stress vs. time (cycles) showing disturbance (softening/damage) and cycles to failure, Nf≈165
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Thermomechanical fatigue test: γ̇=2.78×10−4/s (a) applied shear strain vs. time, γmax=0.10 (b) applied temperature vs. time, Tmin=−20  °C,Tmax=125°C (c) hysteresis loops at different cycles

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