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TECHNICAL PAPERS

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

[+] Author and Article Information
Qiang Xiao, Harold J. Bailey, William D. Armstrong

Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071

J. Electron. Packag 126(2), 208-212 (Jul 08, 2004) (5 pages) doi:10.1115/1.1756144 History: Received March 01, 2003; Revised December 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

Figures

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SEM-BSE micrographs of PbSn eutectic solder
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True stress versus true strain data of PbSn eutectic solder
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Back scatter electron micrographs and tensile measurements of as-quenched and room temperature aged Sn3.9Ag0.6Cu lead free solder
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Optical micrographs of as-quenched and 24 hours at 180°C Sn3.9Ag0.6Cu lead free solder
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Back scatter electron micrographs and tensile measurements of Sn3.9Ag0.6Cu lead free solder aged 24 and 72 hours at 180°C
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Tensile measurements of Sn3.9Ag0.6Cu lead free solder aged at room temperature and 180°C

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