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TECHNICAL PAPERS

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

[+] Author and Article Information
Qiang Xiao, Harold J. Bailey, William D. Armstrong

Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071

J. Electron. Packag 126(2), 208-212 (Jul 08, 2004) (5 pages) doi:10.1115/1.1756144 History: Received March 01, 2003; Revised December 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

Anderson,  I. E., Foley,  J. C., Cook,  B. A., Harringa,  J., Terpstra,  R. L., and Unal,  D., 2001, “Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability,” ASME J. Electron. Mater., 30(9), pp. 1050–1059.
Lin,  K. L., Hsiao,  C. C., and Chen,  K. I., 2002, “Microstructural Evolution of Sn-Ag-Cu-Al Solder with Respect to Al Content and Heat Treatment,” J. Mater. Res., 17(9), pp. 2386–2393.
Ye,  L., Lai,  Z. H., Liu,  J., and Tholen,  A., 2001, “Microstructure Investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead-free Solders,” Soldering & Surface Mount Technology, 13(3), pp. 16–20.
Miyazawa,  Y., and Ariga,  T., 2001, “Influence of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys,” Mater. Trans., JIM, 42(5), pp. 776–782.
Lee,  T. Y., Choi,  W. J., Tu,  K. N., Jang,  J. W., Kuo,  S. M., Lin,  J. K., Frear,  D. R., Zeng,  K., and Kivilahti,  J. K., 2002, “Morphology, Kinetics, and Thermodynamics of Solid-State Aging of Eutectic PbSn and Pb-free Solders(Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu,” J. Mater. Res., 17(2), pp. 291–301.
Vianco,  P. T., and Rejent,  J. A., 2002, “A Methodology to Establish Baseline Metrics for Assessing the Isothermally Aging of Sn-Pb Solder Interconnects,” Soldering and Surface Mount Technology, 14(2), pp. 26–34.
Grusd, A., 1997, Lead Free Solders in Electronics, SMI, pp. 648–661.
Zeng,  K., and Tu,  K. N., 2002, “Six Cases of Reliability Study of Lead-Free Solder Joints in Electronic Packaging Technology,” Mater. Sci. Eng., R., 38, pp. 55–105.
Oh,  C., Shim,  S. J. H., Lee,  B. J., and Lee,  D. N., 1996, “A Thermodynamic Study on the Ag-Sb-Sn System,” J. Alloys Compd., 238, pp. 155–166.
Hayes,  F. H., Lukas,  H. L., Effenberg,  G., and Petzow,  G., 1986, “The Thermodynamic Optimization of the Cu-Ag-Pb System,” Z. Metallkde, 77, pp. 749–754.

Figures

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SEM-BSE micrographs of PbSn eutectic solder
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True stress versus true strain data of PbSn eutectic solder
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Back scatter electron micrographs and tensile measurements of as-quenched and room temperature aged Sn3.9Ag0.6Cu lead free solder
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Optical micrographs of as-quenched and 24 hours at 180°C Sn3.9Ag0.6Cu lead free solder
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Back scatter electron micrographs and tensile measurements of Sn3.9Ag0.6Cu lead free solder aged 24 and 72 hours at 180°C
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Tensile measurements of Sn3.9Ag0.6Cu lead free solder aged at room temperature and 180°C

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