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TECHNICAL PAPERS

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

[+] Author and Article Information
Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag 126(2), 202-207 (Jul 08, 2004) (6 pages) doi:10.1115/1.1756143 History: Received May 01, 2003; Revised November 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

Yim,  M. J., and Paik,  K. W., 1999, “The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF),” IEEE Trans. Of Advanced Packaging, 22(2), pp. 166–173.
Reinert,  W., and Harder,  T., 1996, “Anisotropically Conductive Adhesives for Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates,” IEEE Trans. CPMT, Part B: Advanced Packaging, 19(3), pp. 644–660.
Garrou,  P., Scheck,  D., Im,  J. H., Hetzner,  J., Meyers,  G., Hwan,  D., Wu,  J., Vincent,  M. B., and Wong,  C. P., 2000, “Underfill Adhesion to BCB (Cyclotene™) Bumping and Redistribution Dielectrics,” IEEE Trans. Of Advanced Packaging, 23(3), pp. 568–573.
Im,  J. H., Shaffer,  E. O., Stokich,  T., Strandjord,  A., Hertzer,  J., Curphy,  J., and Karas,  C., 2000, “On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications,” ASME J. Electron. Packag., 122, pp. 28–33.
Dai,  X., Brillhart,  M. V., Roesch,  M., and Ho,  P. S., 2000, “Adhesion and Toughening Mechanisms at Underfill Interfaces for Flip-Chip-on-Organic-Substrate Packaging,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23(1), pp. 117–127.
Tong, Q., Ma, B., Xiao, A., Savoca, A., Luo, S., and Wong, C. P., 2002, “Fundamental Adhesion Issues for Advanced Flip Chip Packaging,” Proceedings of the 52nd Electronic Components and Technology Conference, May, San Diego, pp. 1373–1379.
Im, J., et al., 1998, “On Mechanical Reliability of Photo-BCB based thin Film Dielectric Polymer for Electronic Packaging Applications,” Proc. Workshop Mech. Rel. Polymeric Mater. Plastic Packag. IC Devices, Paris, France, p. 191.
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Figures

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Schematic of (a) die shear test for the evaluation of adhesion strength, and (b) three-point bending test for the interface fractography
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Typical load-displacement responses of (a) die shear testing, and (b) three-point bending testing
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Adhesion strength of BCB-passivated die with thermal cycles
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Polariscopic images of (a) SiN and BCB materials showing characteristic colors, (b) die shear fracture surface with thermal cycles, showing residual BCB at the die corner
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SEM micrographs of three point bending fracture surface of PCB-side (a) before thermal cycling, (b) after 1000 thermal cycles, showing cohesive surface (A), BCB striations (B), smooth surface (C), and BCB cracking (D)
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AFM image from area “B” in Fig. 4, showing striations of BCB passivation. (a) Perspective AFM topography, (b) Height profile.
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SEM micrograph showing the passivation cracks. Cracks develop around the circumference of BCB passivation over aluminum pad and interconnect bumps move with the surrounding BCB
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SEM micrographs of PCB-side fracture surface after 1000 thermal cycles. SEM micrograph at the right-center in this figure represents the fracture surface before thermal cycling.
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Optical micrographs of chip-side fracture surface with thermal cycles. Sliding trace, which is on the aluminum pad, was deviated from the original position to die center and aluminum pad also deformed upon thermal cycling.
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Flip chip structure and magnified view of the right corner of silicon die, showing the UBM/gold bump with BCB passivation. Thermal displacement of BCB passivation fatigue the interconnect bump, leading to functional bump failure.

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