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TECHNICAL PAPERS

Characterization of Substrate Materials for System-in-a-Package Applications

[+] Author and Article Information
Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu

Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Göteborg, Sweden

J. Electron. Packag 126(2), 195-201 (Jul 08, 2004) (7 pages) doi:10.1115/1.1648057 History: Received July 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

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Figures

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Schematic illustration of the structure based on the chip-first principle for System-in-a-Package (SiP) application (not to scale)
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FEM model for the SiP structure: (a) global view (b) a close-up view of the fine mesh
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Illustration of the three-point bending test
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The deformation of the SiP structure under bending
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Stress distribution on (a) LTCC and (b) LCP substrates under bending (BCB layer was removed to visualize the stress pattern in the left part)
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Warpage in a cooling process with (a) LTCC (b) FR4 (c) LCP (d) Teflon substrate material. (The deformation is magnified here. The deformation scale for LTCC, FR4 and LCP is 30, but for Teflon it is 5 since the deformation was large.)
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Deformations in Z direction show the warpage in SiP for four substrates
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Top view of the fully planar MMIC switch module
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The relative dielectric constant of LCP as a function of frequency
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The value of loss tangent as a function of frequency
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Results of the environmental assessment for GWP, ADP, Eco-Indicator 99, EPS, IP/EPS and TPI
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PDFs for emission of CO2 within the system boundaries for LCP, PTFE, Ceramic and FR4. [μFR4=1952,1σFR4=198;μLCP=503,1σLCP=55;μPTFE=991,1σPTFE=140; and μCeramic=1099,1σCeramic=87.]

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