Characterization of Substrate Materials for System-in-a-Package Applications

[+] Author and Article Information
Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu

Swedish Microsystem Integration Technology (SMIT) Center, Division of Electronics Production, School of Mechanical Engineering, Chalmers University of Technology, SE 412 96, Göteborg, Sweden

J. Electron. Packag 126(2), 195-201 (Jul 08, 2004) (7 pages) doi:10.1115/1.1648057 History: Received July 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Schematic illustration of the structure based on the chip-first principle for System-in-a-Package (SiP) application (not to scale)
Grahic Jump Location
FEM model for the SiP structure: (a) global view (b) a close-up view of the fine mesh
Grahic Jump Location
Illustration of the three-point bending test
Grahic Jump Location
The deformation of the SiP structure under bending
Grahic Jump Location
Stress distribution on (a) LTCC and (b) LCP substrates under bending (BCB layer was removed to visualize the stress pattern in the left part)
Grahic Jump Location
Warpage in a cooling process with (a) LTCC (b) FR4 (c) LCP (d) Teflon substrate material. (The deformation is magnified here. The deformation scale for LTCC, FR4 and LCP is 30, but for Teflon it is 5 since the deformation was large.)
Grahic Jump Location
Deformations in Z direction show the warpage in SiP for four substrates
Grahic Jump Location
Top view of the fully planar MMIC switch module
Grahic Jump Location
The relative dielectric constant of LCP as a function of frequency
Grahic Jump Location
The value of loss tangent as a function of frequency
Grahic Jump Location
Results of the environmental assessment for GWP, ADP, Eco-Indicator 99, EPS, IP/EPS and TPI
Grahic Jump Location
PDFs for emission of CO2 within the system boundaries for LCP, PTFE, Ceramic and FR4. [μFR4=1952,1σFR4=198;μLCP=503,1σLCP=55;μPTFE=991,1σPTFE=140; and μCeramic=1099,1σCeramic=87.]




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In