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TECHNICAL PAPERS

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

[+] Author and Article Information
Chyi-Lang Lai, Wen-Bin Young

Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan 70101, ROC

J. Electron. Packag 126(2), 186-194 (Jul 08, 2004) (9 pages) doi:10.1115/1.1649244 History: Received April 01, 2003; Revised November 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

Lau, John H., 1995, Flip Chip Technologies, McGraw-Hill.
Han,  S., and Wang,  K. K., 1997, “Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 20(4), Nov., pp. 424–433.
Han, S., Wang, K. K., and Cho, S. Y., 1996, “Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips,” Electric Components and Technology Conference, pp. 327–334.
Schweibert,  M. K., and Leong,  W. H., 1996, “Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action,” IEEE Trans., Comp., Packag., Manufact. Technol. Part C, 19(2), pp. 133–137.
Nguyen,  L., Quentin,  C., Fine,  P., Cobb,  B., Bayyuk,  S., Yang,  H., and Bidstrup-Allen,  S. A., 1999, “Underfill of Flip Chip on Laminates: Simulation and Validation,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 22(2), pp. 168–176.
Guo, Y., Lehmann, G. L., Driscoll, T., and Cotts, E. J., 1999, “A Model of the Underfill Flow Process: Particle Distribution Effects,” Proc. Electronic Comp. Technol. Conf., pp. 71–76.
Ni, G., Grodon, M. H., Schmidt, W. F., and Selvam, R. P. 1998, “Flow Properties of Liquid Underfill Encapsulations and Underfill Process Considerations,” Electric Components and Technology Conference, pp. 101–108.
Lehmann,  G. L., Driscoll,  T., Guydosh,  N. R., Li,  P. C., and Cotts,  E. J., 1998, “Underfill Process for Direct-Chip-Attachment Packaging,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21(2), pp. 266–274.
Tamada,  K., and Fujikawa,  H., 1957, “The Steady Two-Dimensional Flow of Viscous Fluid at Low Reynolds Numbers Passing Through an Infinite Row of Equal Parallel Circular Cylinder,” Q. J. Mech. Appl. Math., 10(4), pp. 425–432.
White, Frank, M., 1991, Viscous Fluid Flow, McGraw-Hill.
Young,  W. B., 1995, “Thermal Behavior of the Resin and Mold in the Process of Resin Transfer Molding,” J. Reinf. Plast. Compos., 14(4), pp. 310–332.

Figures

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Representative configuration of materials in series
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Control volume of infinite row of equal parallel circular cylinders
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Model of infinite row of equal parallel circular cylinders
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Comparison of theoretical and analytical permeabilities of infinite row of equal parallel circular cylinders at different S/r ratio
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Upper view of the unit cell of arranged solder bumps
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Permeability values of the unit cell of arranged solder bumps at different radius of bumps when a constant gap height 0.1 mm is assumed
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Permeability values of the unit cell of arranged solder bumps at different gap height of chips when a constant radius of bump 0.1 mm is assumed
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Geometry model of chip cavity
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Simulation flow-front shape predicted in this study for injection from the central point of one edge
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Comparisons of experimental and simulation flow-front shape by Han 23 for injection from the central point of one edge
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Comparisons of experimental and simulation flow-front shape by this study for injection from the central point of one edge
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The volume fraction filled as a function of time for various temperatures simulated by this study (solid lines) and the measured data by Han (symbols) 23 for injection from the central point of one edge
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Simulation flow-front shape predicted by this study for dispensing along an edge of chip
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Comparisons of experimental and simulation flow-front shape for dispensing along an edge of chip

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