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TECHNICAL PAPERS

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

[+] Author and Article Information
X. J. Xin

Department of Mechanical and Nuclear Engineering, Kansas State University, Manhattan, KS 66506

Z. J. Pei

Department of Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, KS 66506

Wenjie Liu

Department of Mechanical and Nuclear Engineering, Kansas State University, Manhattan, KS 66506

J. Electron. Packag 126(2), 177-185 (Jul 08, 2004) (9 pages) doi:10.1115/1.1649243 History: Received February 01, 2003; Revised November 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
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References

Figures

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Waviness induced by wire-sawing
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Illustration of wafer grinding
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Effectiveness of grinding and lapping in removing waviness
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Comparison of deformation between grinding and lapping
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Deformation of wafer mid-plane during grinding and its return to original shape
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Illustration of soft-pad grinding
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An approximate FEM model for soft-pad grinding
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Comparison between soft-pad grinding and rigid chuck grinding
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Effects of elastic modulus for linear elastic pad
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Effects of Poisson’s ratio for linear elastic pad
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Deformation history for the four points for small Poisson’s ratio
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Deformation history for the four points for large Poisson’s ratio
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Effects of pad thickness for linear elastic pad
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Stress-strain relation for a bi-linear elastic pad
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Effects of E1 for bi-linear elastic pad
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Effects of E2 for bi-linear elastic pad
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Effects of inflection point for bi-linear elastic pad
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Strain distribution in bi-linear elastic pads with different inflection points (εip)
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Effects of elastic modulus for hyperelastic pad

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