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TECHNICAL BRIEF

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

[+] Author and Article Information
Ismail Fidan

Department of Manufacturing & Industrial Technology, College of Engineering, Tennessee Tech University, Cookeville, TN 38505-5003 e-mail: ifidan@tntech.edu

J. Electron. Packag 126(1), 173-176 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646422 History: Received March 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Fully-automated PCBA manufacturing and remanufacturing cell system developed by the author
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PCBA yield causes and effects
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The number of factors in dispensing affecting solder joint quality output 9
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CAPP tool developed for fine pitch SMT laser soldering
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Visual inspection of joints reflowed by laser

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