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TECHNICAL PAPERS

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

[+] Author and Article Information
T. Elperin, G. Rudin

Department of Mechanical Engineering, The Pearlstone Center for Aeronautical Engineering, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105, Israel

J. Electron. Packag 126(1), 142-147 (Apr 30, 2004) (6 pages) doi:10.1115/1.1649245 History: Received April 01, 2003; Revised November 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Suhir, E., 1988, “Thermal Stress Failures in Microelectronic Components—Review and Extension,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, A. Bar-Cohen and A. D. Kraus, eds., Hemisphere, New York, pp. 337–412.
Hnatek, E., 1987, Integrated Circuit Quality and Reliability, Marcel Dekker, New York, 698 pp.
Lumley,  R., 1969, “Controlled Separation of Brittle Materials Using a Laser,” Am. Ceram. Soc. Bull., 48, pp. 850–854.
Powell, J., 1993, CO2-Laser Cutting, Springer-Verlag, Berlin, 246 pp.
Karaev,  A., and Kornilov,  A., 1982, “Analysis of Peculiarities of the Separation Process of Semiconductor Wafers into Segments Used in the IC Technology,” Phys. Chem. Mater. Treat., 1, pp. 64–67.
Elperin,  T., Kornilov,  A., and Rudin,  G., 2000, “Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips,” ASME J. Electron. Packag., 122, pp. 317–322.
Elperin, T., Kornilov, A., and Rudin, G., 1997, “Advanced Laser Technology for Precise Separation of Brittle Non-Metallic Materials,” Abstracts of the 8th Israel Materials Engineering Conference, Beer-Sheva, April 16–17.
Elperin, T., Kornilov, A., and Rudin, G., 2000, “Formation of Surface Microcracks and Separation of Non-Metallic Materials Using a Laser Thermal Shock,” Abstracts and Proceedings of the 28th Israel Conference on Mechanical Engineering, Beer-Sheva, June 14–15, pp. 411–412.
Liu,  G., Morsi,  Y., and Van Der Walt,  J., 1999, “Analysis of Spray Cooling Heat Flux,” ASME J. Heat Transfer, 121, pp. 742–745.
Noda, N., Hetnarski, R., and Tanigawa, Y., 2000, Thermal Stresses, Lastran Corporation, New York, 333 pp.

Figures

Grahic Jump Location
(a) Scheme of the method for formation of a surface microcrack: 1—laser beam, 2—air-water spray, 3—wafer (b) cracks in a wafer obtained by different laser methods: b1-open crack, b2-through crack, b3-surface microcrack (c) grid of surface microcracks in a wafer
Grahic Jump Location
Different shapes of the laser beam cross-section:a-elliptic, b—rectangular, c—“splitted” beam
Grahic Jump Location
Temperature T on the line of scanning of a laser beam (Gaussian power distribution) vs. longitudinal coordinate y for different values of time t (curve 1—t=0.02 s, curve 2—t=0.1 s, curves 3, 4—t=0.2 s)
Grahic Jump Location
Thermal stress σ at the edge of a wafer (location A-solid lines and location B—dashed lines) vs. time t for different values of the initial distance Δh between a laser beam and the edge of a wafer: Δh=3 mm (curves 1, 4), Δh=2 mm (curves 2, 5) and Δh=0 (curves 3, 6)
Grahic Jump Location
Temperature T on the line of scanning of a laser beam (uniform power distribution-solid lines, “splitted” laser beam-dashed lines) vs. longitudinal coordinate y for different values of time t (curve 1—t=0.02 s, curves 2, 4—t=0.1 s, curves 3, 5—t=0.2 s)
Grahic Jump Location
Thermal stress σ at the edge of a wafer (location A-solid lines and location B-dashed lines) vs. time t for a uniform power distribution (curves 1, 2) and a “splitted” laser beam (curves 3, 4)

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