0
TECHNICAL PAPERS

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

[+] Author and Article Information
M. J. Heffes, H. F. Nied

Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085

J. Electron. Packag 126(1), 135-141 (Apr 30, 2004) (7 pages) doi:10.1115/1.1649242 History: Received March 01, 2003; Revised November 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Schematic diagram of two layer flip chip model
Grahic Jump Location
Finite element mesh for two layer flip chip model
Grahic Jump Location
Schematic showing location of: (a) vertical fillet edge crack and (b) horizontal crack underneath chip.
Grahic Jump Location
Comparison of Von Mises stresses for elastic-plastic and viscoplastic models in the center of the outer-most solder bump
Grahic Jump Location
Comparision of effective plastic strain for the elastic-plastic and viscoplastic models in the center of outer-most solder bump
Grahic Jump Location
Comparison of strain energy release rate for vertical fillet crack. Linear elastic, elastic-plastic and viscoplastic cases.
Grahic Jump Location
Comparison of phase angle for vertical fillet crack. Linear elastic, elastic-plastic and viscoplastic cases.
Grahic Jump Location
Viscoplastic strain in the solder. Comparison between vertical fillet and horzontal crack cases.
Grahic Jump Location
Strain energy release rate comparisons. Vertical fillet crack and horizontal crack.
Grahic Jump Location
Variation in strain energy release rate along the crack front in severe crack model
Grahic Jump Location
Schematic of flip chip cross-section with second level attachment. Vertical fillet crack located in upper right corner.
Grahic Jump Location
Effective strains in outermost solder structures showing the effect of second level attachment. Vertical fillet crack case.
Grahic Jump Location
Strain energy release rate for vertical fillet crack showing the effect of second level attachment

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In