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TECHNICAL PAPERS

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

[+] Author and Article Information
M. J. Heffes, H. F. Nied

Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085

J. Electron. Packag 126(1), 135-141 (Apr 30, 2004) (7 pages) doi:10.1115/1.1649242 History: Received March 01, 2003; Revised November 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

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Figures

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Schematic diagram of two layer flip chip model
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Finite element mesh for two layer flip chip model
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Schematic showing location of: (a) vertical fillet edge crack and (b) horizontal crack underneath chip.
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Comparison of Von Mises stresses for elastic-plastic and viscoplastic models in the center of the outer-most solder bump
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Comparision of effective plastic strain for the elastic-plastic and viscoplastic models in the center of outer-most solder bump
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Comparison of strain energy release rate for vertical fillet crack. Linear elastic, elastic-plastic and viscoplastic cases.
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Comparison of phase angle for vertical fillet crack. Linear elastic, elastic-plastic and viscoplastic cases.
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Viscoplastic strain in the solder. Comparison between vertical fillet and horzontal crack cases.
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Strain energy release rate comparisons. Vertical fillet crack and horizontal crack.
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Variation in strain energy release rate along the crack front in severe crack model
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Schematic of flip chip cross-section with second level attachment. Vertical fillet crack located in upper right corner.
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Effective strains in outermost solder structures showing the effect of second level attachment. Vertical fillet crack case.
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Strain energy release rate for vertical fillet crack showing the effect of second level attachment

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