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TECHNICAL PAPERS

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

[+] Author and Article Information
M. Y. Tsai, C. H. Hsu, C. N. Han

Department of Mechanical Engineering, Chang Gung University, Kwei-Shan, Tao-Yuan, Taiwan 333, ROC

J. Electron. Packag 126(1), 115-119 (Apr 30, 2004) (5 pages) doi:10.1115/1.1648056 History: Received September 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

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Chen,  W. T., and Nelson,  C. W., 1979, “Thermal Stresses in Bonded Joints,” IBM J. Res. Dev., 23(2), pp. 179–187.
Suhir,  E., 1989, “Interfacial Stresses in Bimetal Thermostats,” ASME J. Appl. Mech., 56, pp. 595–600.
Suhir,  E., 1991, “Approximate Evaluation of the Elastic Interfacial Stresses in the Thin Films with Application to High-Tc Superconducting Ceramics,” Int. J. Solids Struct., 27(8), pp. 1025–1034.
Mishkevich, V., and Suhir, E., 1993, “Simplified Engineering Approach for the evaluation of Thermally Induced Stresses in Bi-Material Microelectronic Structures,” ASME Structural Analysis in Microelectronics and Fiber Optics, EEP., Vol. 7, pp. 127–133.
Suhir,  E., 1986, “Stresses in Adhesively Bonded Bi-material Assemblies Used in Electronic Packaging,” Mater. Res. Soc. Symp. Proc., 72 .
Suhir,  E., 1986, “Stresses in Bi-Mettal Thermostats,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir, E., 1987, “Die Attachment Design and Its Influence on Thermal Stresses in the Die and the Attachment,” Proc. 37th Electronics Components Conference, IEEE/EIA, pp. 508–517.
Mirman,  B. A., 1990, “Creep Strains in an Elongated Bond Layer,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(4), pp. 914–928.
Glaser,  J. C., 1990, “Thermal Stresses in Compliantly Joined Materials,” ASME J. Electron. Packag., 112, pp. 24–29.
Matijasevic, G. S., Wang, C. Y., and Lee, C. C., 1993, “Thermal Stress Considerations in Die-Attachment,” Thermal Stresses and Strain in Microelectronics Packaging, John H. Lau, ed., Van Nostrand Reinhold, pp. 194–220.
Michaelides,  S., and Sitaraman,  S. K., 1999, “Die Cracking and Reliable Die Design for Flip-Chip Assemblies,” IEEE Trans. Adv. Packag., 22(4), pp. 602–613.
Timoshenko, S., and Woinowsky-Krieger, S., 1956, Theory of Plates and Shells, 2nd Edition.
Tsai,  M. Y., and Morton,  J., 1991, “The Stresses in a Thermally Loaded Bimaterial Interface,” Int. J. Solids Struct., 28(8), pp. 1053–1075.
Tsai,  M. Y., and Morton,  J., 1992, “A Stress Analysis of a Thermally Loaded Bimaterial Interface: A Localized Hybrid Analysis,” Mech. Mater., 13, pp. 117–130.
Hsu, G. H., 2002, “Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging,” Master Thesis, Chang Gung University, Taiwan.
Bogy,  D. B., and Wang,  K. C., 1971, “Stress Singularities at Interface Corners in Bonded Dissimilar Isotropic Elastic Materials,” Int. J. Solids Struct., 7, pp. 993–1005.
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Figures

Grahic Jump Location
Die attach peel stress distributions for the assembly under ΔT=−1°C, from the corrected and original Suhir’s solutions and finite element results
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Die attach shear stress distributions for the assembly under ΔT=−1°C, from the finite element results with 2-element and 6-element through thickness of die attach layer and 2D axis-symmetrical models
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Die attach peel stress distributions for the assembly under ΔT=−1°C, from the finite element results with 2-element and 6-element through thickness of die attach layer and 2D axis-symmetrical models
Grahic Jump Location
Die attach shear stress distributions for the assembly under ΔT=−1°C, from the corrected and original Suhir’s solutions and finite element results
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Warpage (deflection) of the assembly under ΔT=−1°C, from the corrected and original Suhir’s solutions and finite element results
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Die stress (σx) distributions along the top and bottom lines of the die for the assembly under ΔT=−1°C, from the corrected and original Suhir’s solutions and finite element results
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(a) Three-dimensional finite element model, in which two models with 2-element and 6-element through thickness of die attach layer are used (b) Two-dimensional axis-symmetrical model
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Geometrical and material parameters, and free-body diagram for Suhir’s model

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