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TECHNICAL PAPERS

The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies

[+] Author and Article Information
Thomas D. Moore

Thermomechancial Solutions, and Packaging Development Department, Analog Devices, B.V., Limerick, Irelande-mail: tmoore@thermomechanical.com

John L. Jarvis

Department of Mechanical and Aeronautical Engineering, University of Limerick, Irelande-mail: john.jarvis@ul.ie

J. Electron. Packag 126(1), 106-109 (Apr 30, 2004) (4 pages) doi:10.1115/1.1649240 History: Received January 01, 2003; Revised September 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Timoshenko,  S., 1925, “Analysis of Bi-Metal Thermostats,” J. Opt. Soc. Am., 11, pp. 233–255.
Hess,  M. S., 1969, “The End Problem for a Laminated Elastic Strip-I. The General Solution,” J. Compos. Mater., 3, pp. 262–280.
Hess,  M. S., 1969, “The End Problem for a Laminated Elastic Strip-II. Differential Expansion Stresses,” J. Compos. Mater., 3, pp. 630–641.
Suhir,  E., 1986, “Stresses in Bi-Metal Thermostats,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir, E., 1986, “Stresses in Adhesively Bonded Bi-material Assemblies Used in Electronic Packaging,” Electronic Packaging Materials Science 1986, Materials Research Soc., pp. 133–138.
Suhir,  E., 1989, “Interfacial Stresses in Bimetal Thermostats,” ASME J. Appl. Mech., 56, pp. 595–600.
Ru,  C. Q., 2002, “Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited,” ASME J. Electron. Packag., 124(3), pp. 141–146.
Mirman,  I. B., 1991, “Effects of Peeling Stresses in Bimaterial Assembly,” ASME J. Electron. Packag., 113, pp. 431–433.
Moore,  T. D., and Jarvis,  J. L., 2003, “A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures,” Microelectron. Reliab., 43, pp. 487–494.
Gektin,  V., Bar-Cohen,  A., and Witzman,  S., 1998, “Coffin-Manson Based Fatigue Analysis of Underfilled DCAs,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21, pp. 577–584.
Moore,  T. D., and Jarvis,  J. L., 2004, “Peeling in Bimaterial Beams-The Peeling Moment and Its Relation to the Differential Rigidity,” ASME J. Appl. Mech., 71, in press.

Figures

Grahic Jump Location
A composite element remote from the ends of a bimaterial beam subject to a change in temperature—adapted from 1, Fig. 1
Grahic Jump Location
Interfacial normal actions of each layer of a bimaterial beam on the other layer due to a uniform change in temperature
Grahic Jump Location
Free body diagram of both layers close to the left hand

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