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TECHNICAL PAPERS

Failure Analysis of Miniature Solder Specimen

[+] Author and Article Information
Y. Wei, C. L. Chow

Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, Michigan 48128

H. E. Fang, M. K. Neilsen

Sandia National Laboratories, Albuquerque, NM 87185

T. J. Lim, W. Lu

Sandia National Laboratories, Livermore, CA 94550

J. Electron. Packag 126(1), 100-105 (Apr 30, 2004) (6 pages) doi:10.1115/1.1648060 History: Received June 01, 2001; Revised October 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Equivalent damage distribution at displacement 1.3 mm
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Equivalent damage distribution at displacement 0.283 mm
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Inelastic strain rate distribution at displacement 1.3 mm
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Inelastic strain rate distribution at displacement 0.283 mm
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Deformed elements at displacement 1.3 mm
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Comparison of Load-displacement curves for miniature specimen
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Effect of phase size λ0 on load-displacement curve for miniature specimen
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Loading rate curves for miniature specimen
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Small-size specimen (gage diameter: 0.354 mm, gage length: 2.58 mm, D: 3.175 mm)
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Softening behavior under monotonic tension at strain rate 10−4/s

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