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TECHNICAL PAPERS

Failure Analysis of Miniature Solder Specimen

[+] Author and Article Information
Y. Wei, C. L. Chow

Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, Michigan 48128

H. E. Fang, M. K. Neilsen

Sandia National Laboratories, Albuquerque, NM 87185

T. J. Lim, W. Lu

Sandia National Laboratories, Livermore, CA 94550

J. Electron. Packag 126(1), 100-105 (Apr 30, 2004) (6 pages) doi:10.1115/1.1648060 History: Received June 01, 2001; Revised October 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Basaran,  C., and Yan,  C. Y., 1998, “A Thermodynamic Framework for Damage Mechanics of Solder Joints,” ASME J. Electron. Packag., 120, pp. 379–384.
Wei, Y., Chow, C. L., Fang, H. E., and Neilsen, M. K., 2000, “Constitutive Modeling of Viscoplastic Damage in Solder Material,” IUTAM Symposium on Creep in Structures, Kluwer Academic Publishers, pp. 131–140.
Wei,  Y., Chow,  C. L., Fang,  H. E., and Neilsen,  M. K., 2001, “Characteristics of Creep Damage for 60Sn-40Pb Solder Material,” ASME J. Electron. Packag., 123, pp. 278–283.
Lemaitre, J., and Chaboche, J. L., 1990, Mechanics of Solid Materials, Cambridge University Press.
Kachanov,  L. M., 1958, “On Creep Rupture Time,” Izv. Acad. Nauk SSSR, Otd. Techn. Nauk, 8, pp. 26–31.
Chow,  C. L., and Wang,  J., 1987, “An Anisotropic Theory of Continuum Damage Mechanics for Ductile Fracture,” Eng. Fract. Mech., 27, pp. 547–558.
Chow,  C. L., and Wei,  Y., 1991, “A Model of Continuum Damage Mechanics for Fatigue Fracture,” Int. J. Fract., 50, pp. 301–316.
Chow,  C. L., and Wei,  Y., 1991, “A Damage Mechanics Model of Fatigue Crack Initiation in Notched Plates,” Theor. Appl. Fract. Mech., 16, pp. 123–133.
Chow, C. L., and Wei, Y., 1996, “A Fatigue Damage Model for Crack Propagation,” Advances in Fatigue Lifetime Predictive Techniques, ASTM STP 1292, pp. 86–99.
Wei,  Y., Chow,  C. L., and Liu,  C. T., 2000, “Damage Analysis for Mixed Mode Crack Initiation,” Computer Modeling in Engineering & Sciences, 1, pp. 115–121.
Wei, Y., Chow, C. L., Neilsen, M. K., and Fang, H. E., 2000, “Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material,” ASME International Mechanical Engineering Congress & Exposition, EEP-Vol. 28, pp. 161–165.
Frear, D. R., Burchett, S. N., Neilsen, M. K., and Stephens, J. J., 1997, “Microstructurally Based Finite Element Simulation of Solder Joint Behavior,” Soldering & Surface Mount Technology Vol. 2, pp. 39–42.
Vianco,  P. T., Burchett,  S. N., Neilsen,  M. K., Rejent,  J. A., and Frear,  D. R., 1999, “Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model Based Prediction of Solder Joint Thermal Mechanical Fatigue,” J. Electron. Mater., 28, 11, pp. 1290–1298.
Fu,  C., McDowell,  D. L., and Ume,  I. C., 1998, “A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects,” ASME J. Electron. Packag., 120, pp. 24–34.
Lim, T. J., and Lu, W., 2000, “Length Scale and Aging Effect on the Mechanical Properties of a 63Sn-37Pb Solder Alloy,” ASME International Mechanical Engineering Congress & Exposition, EEP-Vol. 28, pp. 203–206.

Figures

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Deformed elements at displacement 1.3 mm
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Inelastic strain rate distribution at displacement 0.283 mm
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Inelastic strain rate distribution at displacement 1.3 mm
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Equivalent damage distribution at displacement 0.283 mm
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Equivalent damage distribution at displacement 1.3 mm
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Comparison of Load-displacement curves for miniature specimen
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Effect of phase size λ0 on load-displacement curve for miniature specimen
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Loading rate curves for miniature specimen
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Small-size specimen (gage diameter: 0.354 mm, gage length: 2.58 mm, D: 3.175 mm)
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Softening behavior under monotonic tension at strain rate 10−4/s

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