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TECHNICAL PAPERS

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

[+] Author and Article Information
Naotaka Tanaka, Kenya Kawano, Hideo Miura

Mechanical Engineering Research Laboratory, Hitachi Ltd., Tsuchiura, Ibaraki 300-0013, Japan

Yoshiyuki Kado, Ikuo Yoshida

Semiconductor & Integrated Circuit Group, Hitachi Ltd., (Presently Renesas Technology Corp.) Kodaira, Tokyo 187-8588, Japan

J. Electron. Packag 126(1), 82-86 (Apr 30, 2004) (5 pages) doi:10.1115/1.1648059 History: Received November 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Partial cross section of ACF interconnection structure
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Schematic stress-analysis model
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Normal contact stress and plastic strain during temperature cycling of an gold bump at the contact interface mounted on a high-elasticity build-up substrate
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Normal contact stress and plastic strain during temperature cycling of an gold bump at the contact interface mounted on a low-elasticity build-up substrate
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Partial cross section of ACF interconnection structure when mounted on a low-elasticity build-up substrate
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Normal contact stress on a gold bump and plastic strain of a copper pad at the contact interface during temperature cycling mounted on a low-elasticity build-up substrate
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Stress-strain curve for commonly used build-up material
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Stress relaxation rate of build-up material for 0.5% tensile-strain holding test
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Predicted ratio of compressive contact stress decrease of an Au bump with respect to Young’s modulus of the build-up material

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