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TECHNICAL PAPERS

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

[+] Author and Article Information
S. Shakya

Pujara Wirth Torke, Inc., Wauwatosa, WI 53226

S. M. Heinrich

Department of Civil and Environmental Engineering, Marquette University, Milwaukee, WI 53201-1881

P. S. Lee

Rockwell Automation, Milwaukee, WI 53204

J. Electron. Packag 126(1), 74-81 (Apr 30, 2004) (8 pages) doi:10.1115/1.1648058 History: Received December 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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(a) Geometric and material parameters of assembly (b) geometric and material parameters of a typical solder joint; (c) definition of shear displacement Δu
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The equivalent axisymmetric assembly, comprising a homogeneous elastic component and substrate and a uniform viscoelastic solder layer
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Dimensionless plots of Δumax(t)/Δuo vs. t/q for the case of step-function thermal loading
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Dimensionless plots of βve vs. ωq for the case of sinusoidal load. Each family of curves shares the same asymptotic value (βo).
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Comparison plots of frequency correction factors: present study (βve) vs. previous study (Cf)9

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