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TECHNICAL PAPERS

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

[+] Author and Article Information
S. Shakya

Pujara Wirth Torke, Inc., Wauwatosa, WI 53226

S. M. Heinrich

Department of Civil and Environmental Engineering, Marquette University, Milwaukee, WI 53201-1881

P. S. Lee

Rockwell Automation, Milwaukee, WI 53204

J. Electron. Packag 126(1), 74-81 (Apr 30, 2004) (8 pages) doi:10.1115/1.1648058 History: Received December 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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References

Heinrich,  S. M., Shakya,  S., and Lee,  P. S., 1997, “Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints,” ASME J. Electron. Packag., 119(4), pp. 218–227.
Jeannotte, D. A., Goldmann, L. S., and Howard, R. T., 1988, “Package Reliability,” Chapter 5, Microelectronic Packaging Handbook, Tummala, R. R., and Rymaszewski, E. J., eds., pp. 277–301.
Pan,  T., 1991, “Thermal Cycling Induced Plastic Deformation in Solder Joints, Part I: Accumulated Deformation in Surface Mount Joints,” ASME J. Electron. Packag., 113, pp. 8–15.
Halford, G. R., and Manson, S. S., 1976, “Life Prediction of Thermal-Mechanical Fatigue Using Strain Range Partitioning,” Thermal Fatigue of Materials and Components, ASTM STP 612, Spera, D. A., and Mowbray, D. F., eds., pp. 239–254.
Knecht, S., and Fox, L., 1991, “Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction,” Chapter 16, Solder Joint Reliability—Theory and Applications, Lau, J. H., ed, Van Nostrand Reinhold, New York.
Shakya, S., 2000, “Stress Analysis of Bonded Axisymmetric Assemblies Under Thermal Loading: Applications in Microelectronics,” Ph.D. Dissertation, Marquette University, Milwaukee, WI 53233.
Hall,  P. M., 1987, “Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip Carriers,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology,CHMT-12(4), pp. 556–565.
Mirman,  B. A., and Knecht,  S., 1990, “Creep Strains in an Elongated Bond Layer,” IEEE Transactions on Components, Packaging, and Manufacturing Technology,13(4), pp. 914–928.
Heinrich,  S. M., Shakya,  S., Liang,  J., and Lee,  P. S., 2000, “An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects,” ASME J. Electron. Packag., 122(4), pp. 328–334.
Flügge, W., 1975, Viscoelasticity, Second Edition, Springer-Verlag, New York.
Skrzypek, J. J., 1993, Plasticity and Creep: Theory, Examples, and Problems, Hetnarski, R. B. (English Edition Editor), Begell House, CRC Press, Florida.
Cook, R. D., and Young, W. C., 1985, Advanced Mechanics of Materials, Macmillan Publishing Company, New York.
Churchill, R. V., 1958, Operational Mathematics, Second Edition, McGraw-Hill Book Company, Inc., New York.
Tuma, J. J., 1987, Engineering Mathematics Handbook, Third Edition, McGraw-Hill Book Company, New York.
Shakya, S., Heinrich, S. M., Liang, J., and Lee, P. S., 1997, “Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly,” Structural Analysis in Microelectronics and Fiber Optics, EEP-Vol. 21, pp. 55–63.

Figures

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(a) Geometric and material parameters of assembly (b) geometric and material parameters of a typical solder joint; (c) definition of shear displacement Δu
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The equivalent axisymmetric assembly, comprising a homogeneous elastic component and substrate and a uniform viscoelastic solder layer
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Dimensionless plots of Δumax(t)/Δuo vs. t/q for the case of step-function thermal loading
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Dimensionless plots of βve vs. ωq for the case of sinusoidal load. Each family of curves shares the same asymptotic value (βo).
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Comparison plots of frequency correction factors: present study (βve) vs. previous study (Cf)9

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