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TECHNICAL PAPERS

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

[+] Author and Article Information
Xiaojin Wei, Yogendra Joshi

G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

J. Electron. Packag. 126(1), 60-66 (Apr 30, 2004) (7 pages) doi:10.1115/1.1647124 History: Received June 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Three-dimensional stack of microchannels
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Thermal resistance network for a three-layered microchannel stack
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Validation of the iterative method with 3
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Comparison of the ratio of the thermal resistance for different number of layers to that of single layer micro-channel structure
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Comparison of thermal resistance for different number of layers at fixed flow rate (0.83×10−6 m3/s or 50 ml/min)
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Pressure drop and Pumping power at fixed flow rate
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Comparison of thermal resistance for different number of layers at fixed pumping power
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Pressure drop and flow rate at fixed pumping power
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Dimensionless temperature distributions at the outlet cross-section
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Numerical simulation versus resistance analysis
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Variation of normalized thermal resistance with the number of layers for different materials
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Effects of aspect ratio on the thermal resistance for different materials (two-layer microchannel with fixed channel width Wc; fixed flow rate at 6.67×10−6m3/s or 400 ml/min)

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