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TECHNICAL PAPERS

Interfacial Bond Stress Relationship for Gullwing Solder Joints

[+] Author and Article Information
L. L. Meekisho

Portland State University, Portland, OR 97207

K. Nelson-Owusu

Washington County, LUT, Hillsboro, OR 97124

J. Electron. Packag 126(1), 57-59 (Apr 30, 2004) (3 pages) doi:10.1115/1.1646428 History: Received June 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Brown, W. D., ed. 1998, Advanced Electronic Packaging: With Emphasis on Multichip Modules., IEEE Press, pp. 40.
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Chen,  W. T., and Nelson,  C. W., 1979, “Thermal Stresses in Bolted Joints,” IBM J. Res. Dev., 23, pp. 178–188.
Jiang,  Z. O. , 1997, “Thermal Stresses in Layered Electronic Assemblies,” ASME J. Electron. Packag., 119, pp. 127–132.
Suhir,  E., 1986, “Stresses in Bi-Metal Thermostat,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir,  E., 1988, “An Approximate Analysis of Stresses in Multi-layered Elastic Thin Films,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir,  E., 1989, “Interfacial Stresses in BiMaterial Thermosts,” ASME J. Appl. Mech., 56, pp. 596–600.
Pao,  Y. H., and Eisele,  E., 1991, “Interfacial Shear and Peeling Stresses in Multi-layered Thin Stacks-Subjected to Uniform Thermal Loadings,” ASME J. Electron. Packag., 113, pp. 164–172.
Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, 2nd ed., John Wiley & Sons, Inc., New York, pp. 275–326.
Meekisho,  L., and Nelson-Owusu,  K., 2000, “Stress Analysis of Solder Joint with Torsional Eccentricity Subjected to Based Excitation,” Journal of Mathematical Modelling and Scientific Computing, 10, pp. 193–199.
Devletian, J. H., 1999, Private Communication, Oregon Graduate Institute, March.
Hibbeler, R. C., 1995, Structural Analysis. 3rd ed., Prentice Hall, New Jersey, pp. 417.
Boresi, A. P., et al. 1993, Advanced Mechanics of Materials, 5th ed., John Wiley & Sons Canada; pp. 28–101, 385–392.
Nelson-Owusu, Kofi., 2000, “The Thermal-Structural Optimization and Reliability of Leadframe Solder Joint Geometry in Electronic Packaging,” Ph.D. Dissertation, Department of Material Science and Engineering, Oregon Graduate Institute of Science and Technology, Portland, OR.
Wong,  Tin-Lup , 1990, “Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads,” ASME J. Electron. Packag., 112, pp. 168–174.
Winslow, J. W., 1993, “Some Observations of Solder Joint Failure under Tensile-Compressive Stress,” Advances in Electronic Packaging, EEP-Vol. 4-2, ASME.

Figures

Grahic Jump Location
3D FEA View of 20-PIN CQFP
Grahic Jump Location
(a) Mid-plane elevation of gullwing solder joint connection showing applied forces (b) differential elemental forces
Grahic Jump Location
Peeling stress distribution of gullwing solder joint

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