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TECHNICAL PAPERS

Interfacial Bond Stress Relationship for Gullwing Solder Joints

[+] Author and Article Information
L. L. Meekisho

Portland State University, Portland, OR 97207

K. Nelson-Owusu

Washington County, LUT, Hillsboro, OR 97124

J. Electron. Packag 126(1), 57-59 (Apr 30, 2004) (3 pages) doi:10.1115/1.1646428 History: Received June 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

Grahic Jump Location
3D FEA View of 20-PIN CQFP
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(a) Mid-plane elevation of gullwing solder joint connection showing applied forces (b) differential elemental forces
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Peeling stress distribution of gullwing solder joint

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