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TECHNICAL PAPERS

Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

[+] Author and Article Information
L. L. Meekisho

Portland State University, Portland, OR 97207

K. Nelson-Owusu

Washington County, LUT, 155 N First Ave MS 350-12, Hillsboro, OR 97124

J. Electron. Packag 126(1), 52-56 (Apr 30, 2004) (5 pages) doi:10.1115/1.1646429 History: Received June 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Heinrich,  S. M., , 1993, “Effects of Chip and Pad Geometry on Solder Joint Formation in SMT,” ASME J. Electron. Packag., 115, pp. 433–439.
Lee,  T. S., 1997, “Finite Element Modeling of 3-Dimensional Solder Joints Geometry in SMT,” ASME J. Electron. Packag., 119, pp. 118–125.
Nelson-Owusu, Kofi., 2000, “The Thermal-Structural Optimization and Reliability of Leadframe Solder Joint Geometry in Electronic Packaging,” Ph.D. Dissertation, Department of Material Science and Engineering, Oregon Graduate Institute of Science and Technology, Portland, OR.
Meekisho,  L., and Nelson-Owusu,  K., 2000, “Stress Analysis of Solder Joint with Torsional Eccentricity Subjected to Based Excitation,” Journal of Mathematical Modelling and Scientific Computing, 10, pp. 193–199.
Heinrich,  S. M., , 1990, “Solder Joint Formation in Surface Mount Technology, Part 2: Design,” ASME J. Electron. Packag., 113(3), pp. 219–223.
Goldmann,  L. S., “Geometric Optimization of Controlled Collapse Interconnections,” IBM J. Res. Dev., 13, pp. 251–265.
Heinrich,  S. M., , 1990, “Solder Joint Formation in Surface Mount Technology, Part 1: Analysis,” ASME J. Electron. Packag., 113(3), pp. 210–218.
Chiang,  K. N., and Chen,  W. L., 1998, “Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array,” ASME J. Electron. Packag., 120, pp. 175–178.
Meekisho,  L., and Nelson-Owusu,  K., 2004, “Interfacial Bond Stress Relationship for Gullwing Solder Joints,” ASME J. Electron. Packag., in press.
Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, 2nd ed., John Wiley & Sons, Inc., NY, pp. 275–326.
Wong, H., and Lee, T. T., 1996, “Thermal Evaluation of a Power PC 620 Multi-Processor Computer,” Proc. 12th IEEE-THEM Symposium, pp. 72–80.
Stardyne Finite Element Analysis Computer Program User Manual, 1985, Yorba Linda, CA, Research Engineers.
Winslow, J. W., 1993, “Some Observations of Solder Joint Failure under Tensile-Compressive Stress,” EEP-Vol. 4-2, Advances in Electronic Packaging, ASME.

Figures

Grahic Jump Location
Cross section of gullwing leadframe solder joint geometry (a) arbitrary solder shape (b) an enlarged solder fillet described by the governing equation
Grahic Jump Location
Von Mises stress contours
Grahic Jump Location
Peeling (bond) shear stress contours

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