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TECHNICAL PAPERS

Investigation of Flip-Chip Bonding for MEMS Applications

[+] Author and Article Information
W. Salalha, E. Zussman

Manufacturing Systems Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

P. Z. Bar-Yoseph

Computational Mechanics Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

J. Electron. Packag 126(1), 48-51 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646427 History: Received July 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Harsh,  K. F., Su,  B. Z., Zhang,  W. G., Bright,  V. M., and Lee,  Y. C., 2000, “The Realization and Design Considerations of a Flip-Chip Integrated MEMS Tunable Capacitor,” Sens. Actuators A, 80(2), pp. 108–118.
Salalha, W., Zussman, E., Meltser, M., and Kaldor, S., 2000, “Prediction of Yield for Flip-chip Packaging,” Proc. of the 10th CIRP Design Seminar, Israel, pp. 259–263.
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Chiang,  K. N., and Chen,  W. L., 1998, “Electronic Packaging Reflow Shape Prediction for the Solder Mask-Defined Ball Grid Array,” ASME J. Electron. Packag., 120(2), pp. 175–178.
Katyl,  R. H., and Primbley,  W. T., 1992, “Shape and Force Relationships for Molten Axisymmetric Solder Connections,” ASME J. Electron. Packag., 114(3), pp. 336–341.
Patra,  S. K., and Lee,  Y. C., 1991, “Quasi-Static Modeling of the Self-Alignment-Part 1: Single Solder Joint,” ASME J. Electron. Packag., 113(3), pp. 337–342.
Patra,  S. K., Sritharan,  S. S., and Lee,  Y. C., 1995, “Quantitative Characterization of Flip-Chip Solder Joints,” ASME J. Appl. Mech., 62(2), pp. 390–397.
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Nigro,  N. J., Zhou,  F. J., Heinrich,  S. M., Elkouh,  A. F., Fournelle,  R. A., and Lee,  P. S., 1998, “Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints,” ASME J. Electron. Packag., 118(3), pp. 142–147.
Subbarayan,  G., 1996, “A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints,” ASME J. Electron. Packag., 118(3), pp. 127–133.
Salalha, W., Zussman, E., and Bar-Yoseph, P. Z., 2002, “Modeling and Simulation of Flip-Chip Bonding,” Technical Report, TME # 476, Faculty of Mechanical Engineering, Technion—Israel Institute of Technology, Haifa, Israel.
Myshkis, A. D., Babskii, V. G., Kopachevskii, N. D., Solobozhanin, L. A., and Tyuptso, A. D., 1986, Low-Gravity Fluid Mechanics, Springer-Verlag, NY.
Lau, J. H., 1995, Flip Chip Technologies, McGraw-Hill, NY.
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Figures

Grahic Jump Location
Cross section of an axisymmetric solder joint with height, H, and pad radius, rp loaded by a chip with weight, W
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Concave shape of solder joint. Simulation parameters: W=−2.5×10−5 [N],V=1.4137×10−3 [mm3],rp=0.175 [mm],γ=480 [dyne/cm], number of elements=22
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Typical picture of bonded Glass-Chips with pad diameter, rp=300 [μm]: (a) top view of the bottom chip, (b) close-up of the assembled chips before reflow process, (c) close-up of the bonded chips after self-alignment termination
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Typical pictures and SEM fractographs of Silicon-Chips: (a) substrate chip, (b) assembled chips, (c) chip with solder bumps after reflow, (d) SEM picture of solder bump cross section
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Typical pictures and SEM fractographs of Quasi-MEMS chips: (a) top view of a quasi MEMS chip, (b) assembled device, (c) cross section of assembled device with two solder joints, (d) cross section of a single solder bump with stand-of-height, H=86.6 [μm].
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Glass-Chip: Comparison of typical solder joint stand-of-height, H, results obtained by: (a) experiment, (b) axisymmetric FE model (number of elements=20).

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