0
TECHNICAL PAPERS

Investigation of Flip-Chip Bonding for MEMS Applications

[+] Author and Article Information
W. Salalha, E. Zussman

Manufacturing Systems Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

P. Z. Bar-Yoseph

Computational Mechanics Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

J. Electron. Packag 126(1), 48-51 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646427 History: Received July 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Cross section of an axisymmetric solder joint with height, H, and pad radius, rp loaded by a chip with weight, W
Grahic Jump Location
Concave shape of solder joint. Simulation parameters: W=−2.5×10−5 [N],V=1.4137×10−3 [mm3],rp=0.175 [mm],γ=480 [dyne/cm], number of elements=22
Grahic Jump Location
Typical picture of bonded Glass-Chips with pad diameter, rp=300 [μm]: (a) top view of the bottom chip, (b) close-up of the assembled chips before reflow process, (c) close-up of the bonded chips after self-alignment termination
Grahic Jump Location
Typical pictures and SEM fractographs of Silicon-Chips: (a) substrate chip, (b) assembled chips, (c) chip with solder bumps after reflow, (d) SEM picture of solder bump cross section
Grahic Jump Location
Typical pictures and SEM fractographs of Quasi-MEMS chips: (a) top view of a quasi MEMS chip, (b) assembled device, (c) cross section of assembled device with two solder joints, (d) cross section of a single solder bump with stand-of-height, H=86.6 [μm].
Grahic Jump Location
Glass-Chip: Comparison of typical solder joint stand-of-height, H, results obtained by: (a) experiment, (b) axisymmetric FE model (number of elements=20).

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In