Investigation of Flip-Chip Bonding for MEMS Applications

[+] Author and Article Information
W. Salalha, E. Zussman

Manufacturing Systems Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

P. Z. Bar-Yoseph

Computational Mechanics Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000

J. Electron. Packag 126(1), 48-51 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646427 History: Received July 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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Cross section of an axisymmetric solder joint with height, H, and pad radius, rp loaded by a chip with weight, W
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Concave shape of solder joint. Simulation parameters: W=−2.5×10−5 [N],V=1.4137×10−3 [mm3],rp=0.175 [mm],γ=480 [dyne/cm], number of elements=22
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Typical picture of bonded Glass-Chips with pad diameter, rp=300 [μm]: (a) top view of the bottom chip, (b) close-up of the assembled chips before reflow process, (c) close-up of the bonded chips after self-alignment termination
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Typical pictures and SEM fractographs of Silicon-Chips: (a) substrate chip, (b) assembled chips, (c) chip with solder bumps after reflow, (d) SEM picture of solder bump cross section
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Typical pictures and SEM fractographs of Quasi-MEMS chips: (a) top view of a quasi MEMS chip, (b) assembled device, (c) cross section of assembled device with two solder joints, (d) cross section of a single solder bump with stand-of-height, H=86.6 [μm].
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Glass-Chip: Comparison of typical solder joint stand-of-height, H, results obtained by: (a) experiment, (b) axisymmetric FE model (number of elements=20).




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