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TECHNICAL PAPERS

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

[+] Author and Article Information
Seungmin Cho, Bongtae Han

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

Jinwon Joo

Department of Mechanical Engineering, Chungbuk National University, Cheongju Chungbuk, Korea

J. Electron. Packag 126(1), 41-47 (Apr 30, 2004) (7 pages) doi:10.1115/1.1646426 History: Received July 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Schematic illustration of real-time moiré setup for ATC condition
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(a) Schematic diagram of CBGA package assembly with relevant dimensions, (b) initial null fields obtained at room temperature and (c) temperature profile used in the experiment
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Representative V field fringe patterns of the CBGA package assembly
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Relative vertical (or bending) displacements along the middle line of the ceramic module obtained from the moiré patterns
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Schematic illustration of the deformation of the CBGA package assembly during the thermal cycle
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U field fringe patterns corresponding to those of Fig. 3
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U field fringe patterns of the rightmost solder interconnection and the corresponding horizontal displacements determined along the vertical centerline
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Average shear strain history of the bottom eutectic fillet
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(a) Schematic diagram of FC-PBGA package assembly and (b) U and V field fringe patterns recorded at 125°C

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