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TECHNICAL PAPERS

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

[+] Author and Article Information
Seungmin Cho, Bongtae Han

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

Jinwon Joo

Department of Mechanical Engineering, Chungbuk National University, Cheongju Chungbuk, Korea

J. Electron. Packag 126(1), 41-47 (Apr 30, 2004) (7 pages) doi:10.1115/1.1646426 History: Received July 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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References

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Figures

Grahic Jump Location
Schematic illustration of real-time moiré setup for ATC condition
Grahic Jump Location
(a) Schematic diagram of CBGA package assembly with relevant dimensions, (b) initial null fields obtained at room temperature and (c) temperature profile used in the experiment
Grahic Jump Location
Representative V field fringe patterns of the CBGA package assembly
Grahic Jump Location
Relative vertical (or bending) displacements along the middle line of the ceramic module obtained from the moiré patterns
Grahic Jump Location
Schematic illustration of the deformation of the CBGA package assembly during the thermal cycle
Grahic Jump Location
U field fringe patterns corresponding to those of Fig. 3
Grahic Jump Location
U field fringe patterns of the rightmost solder interconnection and the corresponding horizontal displacements determined along the vertical centerline
Grahic Jump Location
Average shear strain history of the bottom eutectic fillet
Grahic Jump Location
(a) Schematic diagram of FC-PBGA package assembly and (b) U and V field fringe patterns recorded at 125°C

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