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TECHNICAL PAPERS

Why Gold Flash Can Be Detrimental to Long-Term Reliability

[+] Author and Article Information
Jingsong Xie, Ming Sun, Michael Pecht, David F. Barbe

CALCE Electronic Products & Systems Center, University of Maryland, College Park, MD 20742

J. Electron. Packag 126(1), 37-40 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646425 History: Received November 01, 2000; Online April 30, 2004
Copyright © 2004 by ASME
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References

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Conrad, L. R., Pike-Biequnski, M. J., and Freed, R. L., 1982, “Creep Corrosion Over Gold, Palladium and Tin-Lead Electroplate,” 15th Annual Connectors and Interconnection Technology Symposium Proceedings, Philadelphia, PA, November, pp. 401–414.
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Figures

Grahic Jump Location
Pore corrosion generated by MFG testing on a gold-plating surface (15 micro-inches of gold over 50 micro-inches of nickel on a phosphor bronze substrate). Coating-surface porosity determines the probability of pore corrosion.
Grahic Jump Location
Creep corrosion of base metal over gold plating. The diffusion behavior of ions, atoms and free electrons is critical to a creep process of corrosion products.
Grahic Jump Location
A comparison of the creep behavior of copper corrosion product (a) over a palladium surface (50 micro-inches of palladium over 50 micro-inches of nickel) and (b) over a gold surface (50 micro-inches of cobalt-hardened gold over 50 micro-inches of nickel) (Conrad et al., 17). The results show a significant difference in the creeping mobility of corrosion product over gold and palladium surfaces.
Grahic Jump Location
A comparison of copper corrosion product creeping over gold surface (a) before and (b) after the corrosion product is completely removed with HCl 17. The results show that the gold surface remains un-corroded during the corrosion accumulation process, and therefore, demonstrate the migration of corrosion product over gold-coated surfaces without attacking them.

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