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TECHNICAL PAPERS

The Moulded Electronic Package (MEP)

[+] Author and Article Information
David J. J. Lowrie

Multicore Solders Ltd., Kelsey House, Wood Lane End, Hemel Hempstead, Hertfordshire HP2 4RQ, United Kingdome-mail: David.Lowrie@MulticoreSolders.com

J. Electron. Packag 126(1), 34-36 (Apr 30, 2004) (3 pages) doi:10.1115/1.1646424 History: Received April 01, 2001; Online April 30, 2004
Copyright © 2004 by ASME
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