Engineering of Superconductive Ceramics

[+] Author and Article Information
Anatoly E. Rokhvarger, Lubov A. Chigirinsky

Polytechnic University, Brooklyn, NY

J. Electron. Packag 126(1), 26-33 (Apr 30, 2004) (8 pages) doi:10.1115/1.1646423 History: Received March 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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AFM image of sintered HTS-CSP composite showing theoretically required nanostructure topology and ceramic body morphology of the HTS-CSP dip adhesion coated nichrome strand substrate; scan size 959.9 nm; x=y=200 nm;z=5 nm.
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V–I measurements of the dry pressed HTS-CSP pellet at room (upper curve) and LN (lower curve) temperatures
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Microscope-enlarged photo of the produced (fired) HTS-CSP adhesion coated silver substrate strand where a part of the HTS-CSP coating layer (∼10 μm thickness) was intentionally removed to demonstrate a structure of the sintered HTS-CSP strand
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(a) and 4 (b) Shown at different scale areas results of the same V–I measurements of the HTS-CSP dip adhesive coated silver substrate strand (curve 3) at LN temperature in comparison with V–I measurements of the used silver substrate strand of 127 μm in diameter at room and LN temperatures (curve 2)
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V–I measurements of the HTS-CSP dip adhesive coated nichrome alloy substrate strand of 50 μm in diameter at room temperature (upper curve) and LN temperature (lower curve)
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Anti-ferromagnetic behavior of the sintered HTS-CSP slip cast plate submerged in LN
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10 μm×10 μm AFM scan sample of the broken fired HTS-CSP material demonstrating nonbrittle character of the material fracture and morphology of the HTS-CSP material; x=y=2000 nm;z=500 nm




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