Engineering of Superconductive Ceramics

[+] Author and Article Information
Anatoly E. Rokhvarger, Lubov A. Chigirinsky

Polytechnic University, Brooklyn, NY

J. Electron. Packag 126(1), 26-33 (Apr 30, 2004) (8 pages) doi:10.1115/1.1646423 History: Received March 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
AFM image of sintered HTS-CSP composite showing theoretically required nanostructure topology and ceramic body morphology of the HTS-CSP dip adhesion coated nichrome strand substrate; scan size 959.9 nm; x=y=200 nm;z=5 nm.
Grahic Jump Location
V–I measurements of the dry pressed HTS-CSP pellet at room (upper curve) and LN (lower curve) temperatures
Grahic Jump Location
Microscope-enlarged photo of the produced (fired) HTS-CSP adhesion coated silver substrate strand where a part of the HTS-CSP coating layer (∼10 μm thickness) was intentionally removed to demonstrate a structure of the sintered HTS-CSP strand
Grahic Jump Location
(a) and 4 (b) Shown at different scale areas results of the same V–I measurements of the HTS-CSP dip adhesive coated silver substrate strand (curve 3) at LN temperature in comparison with V–I measurements of the used silver substrate strand of 127 μm in diameter at room and LN temperatures (curve 2)
Grahic Jump Location
V–I measurements of the HTS-CSP dip adhesive coated nichrome alloy substrate strand of 50 μm in diameter at room temperature (upper curve) and LN temperature (lower curve)
Grahic Jump Location
Anti-ferromagnetic behavior of the sintered HTS-CSP slip cast plate submerged in LN
Grahic Jump Location
10 μm×10 μm AFM scan sample of the broken fired HTS-CSP material demonstrating nonbrittle character of the material fracture and morphology of the HTS-CSP material; x=y=2000 nm;z=500 nm




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In