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TECHNICAL PAPERS

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

[+] Author and Article Information
Li Ming Yu, Bang Han Sur, Kim Young Pyo

Department of Naval Architecture and Ocean Engineering, Chosun University, Guangju 501-759, Korea

Wang Chun Qing, Zhang Lei

State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, P.R. China

J. Electron. Packag 126(1), 22-25 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646421 History: Received February 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

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Schematic illustration of the formation factors of a solder joint
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Initial model of solder joints bridging of QFP leads
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Simulation results of forming process of the solder joint for QFP256 device with the solder volume of 3×10−11 m3
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Effect of solder volume on the solder bridging, (a) 2.67×10−11 m3, (b) 3.10×10−11 m3, (c) 3.18×10−11 m3, (d) 3.22×10−11 m3
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Effect of wetting angle on the solder bridging, V=3.10×10−11 m3 (a): θ=5 deg (b): θ=22 deg (c): θ=23 deg (d): θ=30 deg
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Effect of wetting angle on the critical volume of solder
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Effect of surface tension on the solder bridging, V=3.18×10−11 m3 (a): T=300×10−3 N/m (b): T=470×10−3 N/m (c): T=600×10−3 N/m
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Effect of surface tension on the critical volume of solder

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