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TECHNICAL PAPERS

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

[+] Author and Article Information
Li Ming Yu, Bang Han Sur, Kim Young Pyo

Department of Naval Architecture and Ocean Engineering, Chosun University, Guangju 501-759, Korea

Wang Chun Qing, Zhang Lei

State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, P.R. China

J. Electron. Packag 126(1), 22-25 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646421 History: Received February 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Gao,  Y. X., Fan,  H., and Xiao,  Z., 2000, “A Thermodynamics Model for Solder Profile Evolution,” Acta Mater., 48, pp. 863–874.
Conway,  P. P., Kalantary,  M. R., and Williams,  D. J., 1996, “Experimental Investigation of the Formation of Surface Mount Solder Joints,” ASME J. Electron. Packag., 118(4), pp. 223–228.
Heinrich,  S. M., and Lee,  P. S., 1997, “Solder Geometry Prediction in Electronic Packaging: An Overview,” Advances in Electronic Packaging, 19(2), pp. 1371–1376.
Brake, K. A., 1998, “Surface Evolver Manual,” Version 2.10, The Geometry Center, University of Minnesota, Minneapolis.
Wang,  G. Z., Chen,  Z. N., and Wang,  C. Q., 1998, “Computer Simulation of Three Dimensional Castellated Solder Joint Geometry in Surface Mount Technology,” Modell. Simul. Mater. Sci. Eng., 6, pp. 557–567.
Zhao,  X. J., and Wang,  C. Q., 2000, “An Integrated System for Prediction and Analysis of Solder Interconnection Shapes,” IEEE Transaction on Electronics Packaging Manufacturing, 23(2), pp. 87–91.
Li,  M. Y., Wang,  C. Q., and Zhang,  L., 2001, “Solder Bridge Mechanism in Surface Mount Technology,” Prog. Nat. Sci., 11(3), pp. 221–225.

Figures

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Schematic illustration of the formation factors of a solder joint
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Initial model of solder joints bridging of QFP leads
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Simulation results of forming process of the solder joint for QFP256 device with the solder volume of 3×10−11 m3
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Effect of solder volume on the solder bridging, (a) 2.67×10−11 m3, (b) 3.10×10−11 m3, (c) 3.18×10−11 m3, (d) 3.22×10−11 m3
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Effect of wetting angle on the solder bridging, V=3.10×10−11 m3 (a): θ=5 deg (b): θ=22 deg (c): θ=23 deg (d): θ=30 deg
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Effect of wetting angle on the critical volume of solder
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Effect of surface tension on the solder bridging, V=3.18×10−11 m3 (a): T=300×10−3 N/m (b): T=470×10−3 N/m (c): T=600×10−3 N/m
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Effect of surface tension on the critical volume of solder

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