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TECHNICAL PAPERS

Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board

[+] Author and Article Information
Randy D. Weinstein

Department of Chemical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: randy.weinstein@villanova.edu

Amy S. Fleischer

Department of Mechanical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: amy.fleischer@villanova.edu

Kimberly A. Krug

Department of Chemical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: kimberly.krug@villanova.edu

J. Electron. Packag 126(1), 14-21 (Apr 30, 2004) (8 pages) doi:10.1115/1.1635393 History: Received February 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

Figures

Grahic Jump Location
Possible Heat Source Locations
Grahic Jump Location
Heat Source Configurations
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching from Opposite Sides
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching Along Long Sides
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching Along Short Sides
Grahic Jump Location
FR4 Board-Horizontal, Comparison of Approaching Long Sides to Approaching Short Sides
Grahic Jump Location
FR4 Board-Vertical, Heat Sources Approaching Along Long Sides
Grahic Jump Location
FR4 Board, Heat Sources Approaching Along Short Sides, Comparison of Vertical to Horizontal Orientation
Grahic Jump Location
Cu/FR4 Board-Horizontal, Comparison of Approaching Long Sides to Approaching Short Sides
Grahic Jump Location
Cu/FR4 Board-Vertical, Heat Sources Approaching Along Long Sides
Grahic Jump Location
Cu/FR4 Board-Heat Sources Approaching Along Short Sides, Comparison of Vertical to Horizontal Orientation

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