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TECHNICAL PAPERS

Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board

[+] Author and Article Information
Randy D. Weinstein

Department of Chemical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: randy.weinstein@villanova.edu

Amy S. Fleischer

Department of Mechanical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: amy.fleischer@villanova.edu

Kimberly A. Krug

Department of Chemical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085e-mail: kimberly.krug@villanova.edu

J. Electron. Packag 126(1), 14-21 (Apr 30, 2004) (8 pages) doi:10.1115/1.1635393 History: Received February 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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References

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Moffat, R.J., and Ortega, A., 1986, “Buoyancy Induced Forced Convection,” Heat Transfer in Electronic Equipment-1986, ASME-HTD Vol. 57, pp. 135–144.
Fujii, M., Tomimura, T., and Zhang, X., 1995, “Natural Air Cooling of an Array of IC Boards,” Advances in Electronic Packaging-1995, ASME-EEP Vol. 10, pp. 823–828.
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Chadwick,  M.L., Webb,  B.W., and Heaton,  H.S., 1991, “Natural Convection from Two-Dimensional Discrete Heat Sources in a Rectangular Enclosure,” Int. J. Heat Mass Transfer, 34, pp. 1679–1693.
Hadim,  A., and Ramot,  M., 1993, “Natural Convection in an Enclosure with Discrete Heat Sources on the Vertical Walls,” ASME J. Electron. Packag., 115, pp. 444–448.
Park, S.K., 1999, “Natural Convection Air Cooling Between Vertical Parallel Plates with Heated protrusions Simulating Plate-Mounted Electronic Components Within an Enclosure,” Advances in Electronic Packaging-1999, ASME-EEP Vol. 26, pp. 501–509.
Krane,  R.J., and Phillips,  T.J., 1991, “Natural Convection Cooling of a Horizontally Oriented Component Board in a Low-Aspect-Ratio Enclosure,” ASME J. Electron. Packag., 113, pp. 301–308.
Ortega, A., and Lall, B.S., 1996, “Natural Convection Air Cooling of a Discrete Source on a Conducting Board in a Shallow Horizontal Enclosure,” Proceedings of the12thIEEE SEMI-THERM Symposium, pp. 201–213.
Eveloy,  V., Lohan,  J., and Rodgers,  P., 2000, “A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23, pp. 568–577.
Lohan,  J., Tiilikka,  P., Rodgers,  P., Fager,  C.-M., and Rantala,  J., 2000, “Experimental and Numerical Investigation into the Influence of Printed Circuit Board Construction on Component Operating Temperature in Natural Convection,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23, pp. 578–586.
Yu,  E., and Joshi,  Y.K., 2000, “Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23, pp. 14–22.
Adams,  V.H., Joshi,  Y., and Blackburn,  D.L., 1999, “Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection from Discrete Heat Sources in a Horizontal Narrow-Aspect Ratio Enclosure,” ASME J. Heat Transfer, 121, pp. 992–1001.
Pence, S., 2000, “Thermal Management of Portable Electronic Devices Using Phase Change Materials,” Bachelor’s of Chemical Engineering Thesis, Villanova University, 2000.
Hodes,  M., Weinstein,  R.D., Pence,  S.J., Piccini,  J.M., Manzione,  L., and Chen,  C., 2002, “Transient Thermal Management of a Handset Using Phase Change Material (PCM),” ASME J. Electron. Packag., 124, pp. 419–426.
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Ostrach, S., 1952, “An Analysis of Laminar Free-Convection Flow and Heat Transfer About a Flat Plate Parallel to the Direction of the Generating Body Force,” Technical Note 2635, National Advisory Committee for Aeronautics, Washington D.C.
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Figures

Grahic Jump Location
Possible Heat Source Locations
Grahic Jump Location
Heat Source Configurations
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching from Opposite Sides
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching Along Long Sides
Grahic Jump Location
FR4 Board-Horizontal, Heat Sources Approaching Along Short Sides
Grahic Jump Location
FR4 Board-Horizontal, Comparison of Approaching Long Sides to Approaching Short Sides
Grahic Jump Location
FR4 Board-Vertical, Heat Sources Approaching Along Long Sides
Grahic Jump Location
FR4 Board, Heat Sources Approaching Along Short Sides, Comparison of Vertical to Horizontal Orientation
Grahic Jump Location
Cu/FR4 Board-Horizontal, Comparison of Approaching Long Sides to Approaching Short Sides
Grahic Jump Location
Cu/FR4 Board-Vertical, Heat Sources Approaching Along Long Sides
Grahic Jump Location
Cu/FR4 Board-Heat Sources Approaching Along Short Sides, Comparison of Vertical to Horizontal Orientation

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