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TECHNICAL BRIEFS

Effect of Bonding Force on the Conducting Particle With Different Sizes

[+] Author and Article Information
N. H. Yeung, Y. C. Chan, C. W. Tan

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 125(4), 624-629 (Dec 15, 2003) (6 pages) doi:10.1115/1.1604810 History: Received February 01, 2003; Online December 15, 2003
Copyright © 2003 by ASME
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References

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Figures

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SEM micrograph of a gold bump/copper pad connection in a FC-on-flex assembly
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(a) Heat transfer of the ACF assembly after 0.5 sec; (b) heat transfer of the ACF assembly after 4 sec
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Deformation pattern of conducting particle at bonding force 50 MPa (ISO view)
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Deformation pattern of conducting particle at bonding force 50 MPa (front view)
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Percentage change of conducting particle height at different bonding force
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Stress distribution after time=1.13 sec
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Stress distribution after time=5.58 sec
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Stress distribution after time=10 sec
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Von Mises stress of the conducting particle at different bonding force
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Cracks were found on the surface of the conducting particles
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(a) Principal stress ς11 of conductive coating; (b) principal stress ς22 of conductive coating; (c) principal stress ς33 of conductive coating
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Von Mises stress of plastic particle
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(a) Principal stress ς11 of plastic particle; (b) principal stress ς22 of plastic particle

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