3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

[+] Author and Article Information
John H. Lau

Agilent Technologies, Inc., 5301 Stevens Creek Boulevard, Santa Clara, CA 95052

Stephen H. Pan

Optimal Corporation, 6980 Santa Teresa Blvd, Suite 100, San Jose, CA 95119

J. Electron. Packag 125(4), 621-624 (Dec 15, 2003) (4 pages) doi:10.1115/1.1604805 History: Received October 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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Grahic Jump Location
Focused ion beam (FIB) images taken at various stages of cutting through a matte Sn whisker on a Cu substrate
Grahic Jump Location
Schematic of tin whisker formation mechanisms
Grahic Jump Location
Schematic drawing of the axisymmetric structure for analysis
Grahic Jump Location
Finite element model for analysis (a 7-MPa compression is applied in the Sn layer)
Grahic Jump Location
Displacement vector plot (tin whisker initiated)
Grahic Jump Location
Hydrostatic stress contour
Grahic Jump Location
von Mises equivalent stress contour




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