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TECHNICAL PAPERS

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

[+] Author and Article Information
X. J. Zhao, J. F. J. M. Caers

CFT-AP/Philips Electronics Singapore, 620A, Lorong 1 Toa Payoh, 319762, Singapore

G. Q. Zhang

CFT/Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

L. J. Ernst

Delft University of Technology, 2600 GA Delft, The Netherlands

J. Electron. Packag 125(4), 582-588 (Dec 15, 2003) (7 pages) doi:10.1115/1.1604160 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Procedure to determine and apply the fatigue life model
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Fatigue life in the T-shock test versus component size for two different ratios of solder land size at PCB to resist opening at the component side
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Cross section of solder joint after the T-shock tests
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Cross section of solder joint before the T-shock test
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Loading profile in the modeling
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Generation of solder geometry
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FEM model for CSP with 7×7 M solder joints
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Equivalent plastic strain distribution at the end of the second cycle in the solder joints
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Plastic strain distribution in the boundary interface layer with 10 μm thickness
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Plastic strain distribution in the boundary interface layer with 20 μm thickness
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Four selected elements with highest plastic strain
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Plastic strain distribution in the corner joint
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Equivalent plastic strain history output from Ansys
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Total accumulated equivalent plastic strain history after post processing
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Empirical life model based on damage criterion C1
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Empirical life model based on damage criterion C2
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Empirical life model based on damage criterion C3
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Empirical life model based on damage criterion C4

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