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TECHNICAL PAPERS

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

[+] Author and Article Information
Chang-An Yuan, Kou-Ning Chiang

Department of Power Mechanical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., HsinChu Taiwan 300

J. Electron. Packag 125(4), 576-581 (Dec 15, 2003) (6 pages) doi:10.1115/1.1604159 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Moments versus shear displacements
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Axial forces versus axial displacements
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Effective material properties
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A typical wafer level packaging
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Scheme for equivalent beam method
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A typical cantilever beam with three different cross sections
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A typical cantilever beam with three different cross sections
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The equivalent beam coefficients obtained process
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Tensile stress-strain relations of eutectic solder joint
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Shear forces versus shear displacements

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