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TECHNICAL PAPERS

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

[+] Author and Article Information
Chang-An Yuan, Kou-Ning Chiang

Department of Power Mechanical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., HsinChu Taiwan 300

J. Electron. Packag 125(4), 576-581 (Dec 15, 2003) (6 pages) doi:10.1115/1.1604159 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Chiang,  K. N., Lin,  Y. T., and Cheng,  H. C., 2000, “On Enhancing Eutectic Solder Joint Reliability Using a Second-Reflow-Process Approach,” IEEE Trans. Adv. Packag., 123, pp. 9–14.
Mercado, L., Sarihan, V., Guo, Y., and Mawer, A., 1999, “Impact of Solder Pad Size on Solder Joint Reliability in Flip Chip PBGA Packages,” Proceedings of Proceedings of 49th Electronic Components and Technology Conference, San Diego, California, USA, pp. 255–259.
Chiang,  K. N., and Chen,  W. L., 1998, “Electronic Packaging Reflow Shapes Prediction for Solder Mask Defined Ball Grid Array,” ASME J. Electron. Packag., 120, pp. 175–178.
Li,  L., and Yeung,  H., 2001, “Wafer Level and Flip Chip Design Through Solder Prediction Models and Validation,” IEEE Transactions on Components and Packaging Technologies, 24, pp. 650–654.
Chiang,  K. N., and Yuan,  C. A., 2001, “An Overview of Solder Bump Shape Prediction Algorithms with Validations,” IEEE Trans. Adv. Packag., 24, pp. 158–162.
Cheng,  H. C., Chiang,  K. N., and Lee,  M. H., 1998, “An Effective Approach for Three Dimensional Finite Element Analysis of Ball Grid Array Typed Packages,” ASME J. Electron. Packag., 120, pp. 129–134.
Voleti,  S. R., Candra,  N., and Miller,  J. R., 1996, “Global-Local Analysis of Large-Scale Composite Structures Using Finite Element Methods,” Comput. Struct., 58, pp. 453–464.
Corbin,  J. S., 1993, “Finite Element Analysis for Solder Ball Connect (SBC) Structure Design Optimization,” IBM J. Res. Dev., 37, pp. 585–596.
Brakke, K. A., 1994, “Surface Evolver Manual,” Version 1.95, The Geometry Center, 1300 S. Second St., Minneapolis, MN 55454.
Racz, L. M., and Szekely, J., 1993, “An Analysis of the Applicability of Wetting Balance Measurements of Components with Dissimilar Surfaces,” Proceedings of Advances in Electronic Packaging, NY, USA, EEP-Vol. 4-2, pp. 1103–1111.
Brakke,  K. A., 1996, “The Surface Evolver and the Stability of Liquid Surface,” Philos. Trans. R. Soc. London, Ser. A, 354, pp. 2143–2157.
Cowper,  G. R., 1996, “The Shear Coefficient in Timoshenko’s Beam Theory,” ASME J. Appl. Mech., 33, pp. 335–340.
Riemer, D. E., 1990, “Prediction of Temperature Cycling Life for SMT Solder Joints on TCE-Mismatched Substrates,” Proceedings of 40th Electronic Components and Technology Conference, Las Vegas, USA, Vol. 1, pp. 418–425.

Figures

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Scheme for equivalent beam method
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A typical cantilever beam with three different cross sections
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A typical cantilever beam with three different cross sections
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The equivalent beam coefficients obtained process
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Tensile stress-strain relations of eutectic solder joint
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Shear forces versus shear displacements
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Moments versus shear displacements
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Axial forces versus axial displacements
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Effective material properties
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A typical wafer level packaging

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