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TECHNICAL PAPERS

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

[+] Author and Article Information
A. A. O. Tay, K. H. Lee, K. M. Lim

Centre for IC Failure Analysis and Reliability, Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, Singapore 117576

J. Electron. Packag 125(4), 569-575 (Dec 15, 2003) (7 pages) doi:10.1115/1.1604803 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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The distance r between the source point P and the field point Q
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Model of cross section of IC package
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Energy release rate G (left crack tip) at different crack lengths and positions
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Phase angle (left crack tip, r⁁=10 μm) at different crack lengths and positions
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Energy release rate G (right crack tip) at different crack lengths and positions
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Phase angle (right crack tip, r⁁=10 μm) at different crack lengths and positions
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Energy release rate G (left crack tip) with right crack tip at 0, 20 μm from corner
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Phase angle (left crack tip, r⁁=10 μm) with right crack tip at 0, 20 μm from corner
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Possible delamination propagation behavior

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