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TECHNICAL PAPERS

Reliability Prediction of Area Array Solder Joints

[+] Author and Article Information
Rainer Dudek, Ralf Döring, Bernd Michel

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Otto-Schmerbach-Str. 19, D-09117 Chemnitz

J. Electron. Packag 125(4), 562-568 (Dec 15, 2003) (7 pages) doi:10.1115/1.1604802 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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FE model of a CCGA with every second column modeled
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Double symmetrical FE model of a PBGA 272 containing each ball
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FE model of a PBGA 272, only three peripheral ball rows modeled, view on solder balls
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Slice FE model of a PBGA 272
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Plane FE model of a PBGA 272, diagonal cross section
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FE model of a FC-CSP containing each peripheral ball
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Temperatures within a PBGA 272 after 5 min air cooling from 150 to −40°C
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PBGA and CSP temperatures at different locations versus a linearized air temperature cycle
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CSP temperatures at the die in dependence on the ramp rate of the air temperature
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Deformed state and distribution pattern of vertical displacements for the PBGA
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Accumulated equivalent creep strain at the solder balls for one thermal cycle 125–−40°C
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PBGA maximum equivalent creep strain results for different geometric models
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PBGA maximum creep dissipation density for different geometric models
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Deformed state and distribution pattern of out-of-plane displacements for the FC-CSP with board thickness 1.5 mm
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Schematic of the maximum accumulated equivalent creep strain (%) at the solder balls for one thermal cycle 150–−40°C
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Schematic of the maximum accumulated equivalent creep strain (%) at the solder balls, board thickness increased from 0.8 to 1.5 mm

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