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TECHNICAL PAPERS

Three- and Four-Point Bend Testing for Electronic Packages

[+] Author and Article Information
Santosh Shetty, Tommi Reinikainen

Nokia Inc., 6000, Connection Drive, Irving, Texas 75039, USA

J. Electron. Packag 125(4), 556-561 (Dec 15, 2003) (6 pages) doi:10.1115/1.1604158 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Bending test specimen with 66 CSPS
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Schematic of the three-point bend test fixture and curvature distribution along the test specimen
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Bending fatigue test results. (a) Packages on the top; (b) packages on the bottom.
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Finite element models used for global simulation. (a) Global model; (b) simplified package used in the global model.
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Finite element model used for local simulations. (a) Local model (row 0 components); (b) local model (row 1 components and on); (c) sectional view of the local model; (d) finite element mesh of the noncritical solder joint; (e) finite element mesh of the critical solder joint.
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Global simulation results
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Local model simulation results (row 1). (a) Displacement contour; (b) strain energy density (corner critical solder joint).
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Cross-section image showing the failure site
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Strain energy density averaging
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Reliability model (correlating simulations with experiments)
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Correlation between the simulation and experimental results
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Schematic of four-point bending model
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Boundary conditions (four-point bend)
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Four-point bending global simulation. (a) Deformation contour; (b) von Mises Stress contour (solder joints).

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