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TECHNICAL PAPERS

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

[+] Author and Article Information
L. J. Ernst, K. M. B. Jansen

Faculty of Design, Engineering and Production, Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands

G. Q. Zhang

Center for Industrial Technology/Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

H. J. L. Bressers

Philips Semiconductors, ATO-Innovation, Gerstweg 2, 6534 AE Nijmegen, The Netherlands

J. Electron. Packag 125(4), 539-548 (Dec 15, 2003) (10 pages) doi:10.1115/1.1604156 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Pang,  J. H. L., Tan,  T. I., Chong,  Y. R., Lim,  G. Y., and Wong,  C. L., 1998, “Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Board (FCOB) Package Reliability,” J. of Electron. Manufact.,8, pp. 181–191.
Goh, T. J., 1999, “Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package,” Proc. of Workshop on Polymeric Materials for Microelectronics and Photonics Applications ASME, Paris, EEP-Vol. 27, pp. 71–76.
Nakamura,  S., Miyano,  Y., Sugimori,  S., and Kaneda,  A., 1988, “Thermoviscoelastic Analysis of Residual Stresses in a Thermosetting Resin/Metal Laminated Beam Caused by Cooling,” JSME Int. J., Ser. I, 31, pp. 126–131.
Yeung, T. S., and Yuen, M. M. F., 1996, “Viscoelastic Analysis of IC Package Warpage,” Sensing, Modeling and Simulation in Emerging Electronic Packaging ASME, EEP-Vol. 17, pp. 101–107.
Yi,  S., and Sze,  K. Y., 1998, “Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages,” ASME J. Electron. Packag., 120, pp. 385–390.
Xiong, Z., and Tay, A. A. O., 2000, “Modeling of Viscoelastic Effects on Interfacial Delamination in IC Packages,” Proc. 50th ECTC, Electronic Components and Technology Conf., Las Vegas, NV.
Kiasat, M. S., Nijhof, A. H. J., Blokland, H., and Marissen, R., 1997, “Shrinkage and Stress Build-up in Unsaturated Polyester Resin During Curing,” Proc. 5th European Conf. on Advanced Materials and Processes and Applications, EUROMAT 97, Maastricht, The Netherlands, Vol. 2, pp. 95–102.
Kiasat, M. S., 2000, “Curing Shrinkage and Residual Stresses in Viscoelastic Thermosetting Resins and Composites,” Ph.D. thesis, Delft University of Technology, Delft, The Netherlands.
Ernst, L. J., van ’t Hof, C., Zhang, G. Q., Yang, D. G., Kiasat, M. S., Bressers, H. J. L., Caers, J. F. J., and Janssen, J., 2000, “Determination of Visco-Elastic Properties During the Curing Process of Underfill Materials,” Proc. 50th ECTC, Electronic Components and Technology Conf., Las Vegas, NV, pp. 1070–1077.
Tschoegl, N. W., 1989, The Phenomenological Theory of Linear Viscoelastic Behavior: An Introduction, Springer, Berlin.
Wisse, G., Jansen, K. M. B., Ernst, L. J., Kiasat, M. S., Zhang, G. Q., Bressers, H. L. J., and Janssen, J., 2001, “Time Dependent Behavior of Molding Compound in Packaging,” Proc. of the 13th European Microelectronics and Packaging Conference & Exibition, Strassbourg, International Micrelectronics and Packaging Society (IMAPS), France, pp. 389–392.

Figures

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Poisson’s ratio of the compound during the creep
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Construction of the creep tensile compliance master curve
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Creep tensile compliance master curve
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Possible test configurations
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Tensile creep specimen with xy high-temperature strain gauges
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Creep compliance of the molding compound at six temperatures
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Shift factor for the compliance master curve
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Shifted Poisson’s ratio curves
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Smoothed Poisson’s ratio master curve
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The established master curves for the relaxation shear and bulk modulus
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FEM+theoretical shear relaxation curves of a bi-temperature problem
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Temperature profile in a nonisothermal test
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Measured and simulated axial strain in a transient temperature tensile creep test
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A half cross section of the package and specification of the package mesh
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Axisymmetric mesh of the package cross section
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Temperature-dependent elastic model of compound
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(a) thermal load histogram, B=23 min, C=1 day, D=22 min; (b) stress parameter (for surface initiated die cracking in point A of Fig. 15)

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