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TECHNICAL PAPERS

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

[+] Author and Article Information
L. J. Ernst, K. M. B. Jansen

Faculty of Design, Engineering and Production, Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands

G. Q. Zhang

Center for Industrial Technology/Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

H. J. L. Bressers

Philips Semiconductors, ATO-Innovation, Gerstweg 2, 6534 AE Nijmegen, The Netherlands

J. Electron. Packag 125(4), 539-548 (Dec 15, 2003) (10 pages) doi:10.1115/1.1604156 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Possible test configurations
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Tensile creep specimen with xy high-temperature strain gauges
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Creep compliance of the molding compound at six temperatures
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Poisson’s ratio of the compound during the creep
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Construction of the creep tensile compliance master curve
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Creep tensile compliance master curve
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Shift factor for the compliance master curve
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Shifted Poisson’s ratio curves
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Smoothed Poisson’s ratio master curve
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The established master curves for the relaxation shear and bulk modulus
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FEM+theoretical shear relaxation curves of a bi-temperature problem
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Temperature profile in a nonisothermal test
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Measured and simulated axial strain in a transient temperature tensile creep test
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A half cross section of the package and specification of the package mesh
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Axisymmetric mesh of the package cross section
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Temperature-dependent elastic model of compound
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(a) thermal load histogram, B=23 min, C=1 day, D=22 min; (b) stress parameter (for surface initiated die cracking in point A of Fig. 15)

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