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TECHNICAL PAPERS

Characterization of Lead-Free Solders in Flip Chip Joints

[+] Author and Article Information
S. Wiese, E. Meusel

Dresden University of Technology, Semiconductor & Microsystems Technology Laboratory, TU Dresden, IHM, D-01062 Dresden, Germany

J. Electron. Packag 125(4), 531-538 (Dec 15, 2003) (8 pages) doi:10.1115/1.1604155 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Structure of flip chip bump and joint
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Course of a reversible creep experiment
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Optical micrograph of Sn95.5Ag4Cu0.5 solder (Hereaus F365) in a flip chip and a bulk specimen
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Creep data of Sn96.5Ag3.5 solder and Sn95.5Ag4Cu0.5 solder in flip chip joints
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Back scattered electron images of the Sn63Pb67 solder in a flip chip and a bulk specimen
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Creep data of Sn63Pb37 flip chip solder
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Crack evolution on a SnPb37 flip chip joint (0/75/150/300 cycles, displacement amplitude=5 μm)
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Drop of force amplitude for different isothermal fatigue tests conducted with a displacement amplitude of Δs=1.3 μm and wave periods of T=1, 100, 1000 s
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Comparison of creep data from Sn63Pb37, Sn96.5Ag3.5, and Sn95.5Ag4Cu0.5 solder in flip chip joints for a temperature of T=27°C (the flip chip creep data from T=5°C–50°C was corrected for this temperature)
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Scanning electron microscope (SEM) photograph of a specimen joint and the corresponding FEM calculation
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Crack propagation data from isothermal fatigue experiments on Sn63Pb37 and Sn95.5Ag4Cu0.5 flip chip solder joints correlated to plastic strain energy ΔWpl
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Crack propagation data from isothermal fatigue experiments on Sn63Pb37 and Sn95.5Ag4Cu0.5 flip chip solder joints correlated to accumulated inelastic strain εacc

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