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TECHNICAL PAPERS

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

[+] Author and Article Information
M. Carmona, S. Marco, J. Samitier

Sistemes d’Instrumentació i Communicació (SIC), Departament d’Electrònica, Facultat de Fı́sica, Universitat de Barcelona, C/Martı́ i Franquès 1, 08028 Barcelona, Spain

M. C. Acero, J. A. Plaza, J. Esteve

Centre Nacional de Microelectrònica, Campus UAB, 08193-Bellaterra, Spain

J. Electron. Packag 125(4), 527-530 (Dec 15, 2003) (4 pages) doi:10.1115/1.1604154 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Olsson, A., Enoksson, P., Stemme, E., and Stemme, G., 1995, “A Valve-less Planar Pump Isotropically Etched in Silicon,” MME’95, Ostrava, September, pp. 120–123.
Zengerle, R., Richter, A., and Sandmaier, H., 1992, “A Micro Membrane Pump with Electrostatic Actuation,” MEMS’92, Travemünde, February, pp. 19–24.
Van de Pol,  F. C. M., Wonnink,  D. G. J., Elwenspoek,  M., and Fluitman,  J. H. J., 1989, “A Thermo-Pneumatic Actuation Principle for a Microminiature Pump and Other Micromechanical Devices,” Sens. Actuators, 17, pp. 139–143.
Van de Pol,  F. C. M., Elwenspoek,  M., and Fluitman,  J. H. J., 1990, “A Thermopneumatic Micropump Based on Micro-Engineering Techniques,” Sens. Actuators A, A21–23, pp. 198–202.
Zengerle,  R., Geiger,  W., Richter,  M., Ulrich,  J., Kluge,  S., and Richter,  A., 1995, “Transient Measurements on Miniaturized Diaphragm Pumps in Microfluid Systems,” Sens. Actuators A, A46–47, pp. 557–561.
Carmona, M., 2000, “Modelización y Simulación de Microsistemas: Aplicación a Componentes de Microfluı́dica,” Ph.D. thesis, Universitat de Barcelona.
Acero,  M. C., Plaza,  J. A., Esteve,  J., Carmona,  M., Marco,  S., and Samitier,  J., 1997, “Design of a modular micropump based on anodic bonding,” J. Micromech. Microeng., 7, pp. 179–182.
Marco, S., Carmona, M., and Samitier, J., 1998, “Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations,” MSM’98, California, April, pp. 157–162.
Carmona, M., Marco, S., and Samitier, J., 2001, “Performance of a Thermo-Pneumatic Actuated Micropump: Influence of the Fluidic Components,” Benefiting from thermal and mechanical simulation in Micro-Electronics, EuroSimE’01, Europia, Paris, pp. 291–296.
Rencz, M., Székely, V., Kohári, Zs., Ress, S., and Poppe, A., 1999, “Thermal Evaluation of the SIP9 Package,” THERMINIC’99, Rome, October, pp. 111–116.
Goodson,  K. E., Flik,  M. I., Su,  L. T., and Antoniadis,  D. A., 1993, “Annealing Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide layers,” IEEE Electron Device Letters, 14, pp. 490–492.
Paul, O., von Arx, M., and Baltes, H., 1995, “Process-Dependent Thermophysical Properties of CMOS IC Thin Films,” in Digest of Technical Papers, Proceedings of the Transducers’95, Vol 1, Stockholm, June 25–29, pp. 178–181.
Carmona,  M., Marco,  S., Palacin,  J., and Samitier,  J., 1999, “A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form,” IEEE Transactions on Components and Packaging Technology, 22, 2, pp. 238–244.

Figures

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Schematic section of the thermo-pneumatic actuated micropump
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Schematic lumped representation of the fluidic model of the micropump. Capacitance represents the deformable membrane and the valves are modeled as nonlinear resistances.
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Displacement (in cm) of the membrane obtained by coupled thermo-mechanical simulation of a thermo-pneumatic actuation unit (power=180 mW)
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Comparison between the experimental mean temperature over the electrical resistance and the temperature obtained by FEM simulations
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Dynamic maximum membrane displacement obtained from thermal simulations with a power of 0.28 W
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Comparison of the dynamic response of the maximum membrane displacement for the lower time constant
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Comparison between simulation and experimental results of the dynamic maximum membrane displacement with the addition of a thermal resistance

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