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TECHNICAL PAPERS

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

[+] Author and Article Information
W. D. van Driel, J. H. J. Janssen

Philips Semiconductors, ATO Innovation, P.O. Box 30008, 6534 AE Nijmegen, The Netherlands

G. Q. Zhang

Philips CFT, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

D. G. Yang, L. J. Ernst

Delft University of Technology, P.O. Box 5033, 2600 GA Delft, The Netherlands

J. Electron. Packag 125(4), 520-526 (Dec 15, 2003) (7 pages) doi:10.1115/1.1604153 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

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George, A., 1999, “Elastic Constants and Moduli of Diamond Cubic Si,” in Properties of Crystalline Silicon, edited by R. Hull, Inspec Publishing, London.
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Yi,  S., and Sze,  K. Y., 1998, “Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages,” ASME J. Electron. Packag., 120, pp. 385–390.
Boomen, R. v.d., and Seegers, M. C., 1990, “Leadframe Materials,” Philips internal report.
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Yang,  D. G., Ernst,  L. J., Bisschop,  J., Janssen,  J., Kuper,  F., Liang,  Z. N., Schravendeel,  R., and Zhang,  G. Q., 2000, “Vertical Die Crack Stresses of Flip Chip Induced in Major Package Assembly Processes,” Microelectron. Reliab., 40, pp. 1533–1538.
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Figures

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(a) Bending and (b) torsion DMA test
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The results of a frequency sweep DMA on the molding compound
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The master curve for the storage Young’s modulus fitted by the fractional series
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Master curves for the relaxation Young’s E(t), shear G(t), and bulk K(t) modulus [MPa]
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3D FE model for the QFP package
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2D axi-symmetric FE model for the QFP package
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Temperature-dependent Young’s modulus [MPa] and CTE [ppm/°C] for the glue
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Time temperature profile for the complete manufacturing process
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Distribution of the stress components σxx [MPa] along the path from center to the edge of the die bottom (a) at wire bonding temperature (b) cooling down to −65°C from molding
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Vertical displacement distribution [mm] of the die after temperature cycling at −65°C (a) isotropic (b) anisotropic die.
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Stress σxx [MPa] distribution in the die at −65°C for (a) linear compound and (b) viscoelastic compound behavior. Original and deformed shape (10×) are presented.
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Stress σxx [MPa] evolution in the compound for a point above the die during assembly
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Shear stress σxy [MPa] along path A-B at the die-compound interface during thermal cycling at −65°C

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