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TECHNICAL PAPERS

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

[+] Author and Article Information
C. J. Liu, L. J. Ernst, G. Wisse

Delft University of Technology, Faculty DEP, Department of Mechanics and Control, Mekelweg 2, 2628CD Delft, The Netherlands

G. Q. Zhang, M. Vervoort

Philips CFT, P.O. Box 218/SAQ, 5600 MD, Eindhoven, The Netherlands

J. Electron. Packag 125(4), 512-519 (Dec 15, 2003) (8 pages) doi:10.1115/1.1604152 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Kachanov, L. M., “Delamination Buckling of Composite Materials.”
Yin,  W. L., 1989, “Recent Analytical results on Delamination Buckling and Growth,” Key Eng. Mater., 37 .
O’Brien, T. K., 1980, “Characterization of Delamination Onset and Growth in a Composite Laminate,” ASTM.
Kim,  R. Y., 1989, “Initiation of Free-Edge Delamination in Composite Laminates,” Key Eng. Mater., 37 .
Wang, A. S. D., 1989, “An Overview of the Delamination Problem in Structural Composite” in Interlaminar Fracture of Composites, Trans Tech Publ., Switzerland.
Liu, C. J., Nijhof, A. H. J., Ernst, L. J., and Marissen, R., 2000, “Subcritical Matrix Failures in Cross-Ply Composite Laminates with Double-edge-semicircular notches,” IASS-IACM.
Crossman, F. W., and Wang, A. S. D., 1980, “The dependence of transverse Cracking and Delamination on Ply Thickness in Graphiet-Epoxy Laminates,” ASTM.
Shih,  C. F., 1991, “Cracks on Bimaterial Interfaces: Elasticity and Plasticity Aspect,” Mater. Sci. Eng., A, 143 .
Hutchinson,  J. W., and Suo,  Z., 1991, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29 .
Auersperg, J., Kieselstein, E., and Michel, B., “Mixid Mode Interfacial Fracture Thoughness Investigations for Thermo-Mechanical Reliability Enhancement of Plastic Packages,” in Micro Materials, April, 2000, Berlin.

Figures

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Model the interface with randomly distributed voids and microcracks, inducing “weak interface” properties
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Global FEM mesh and a local refinement
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Overall deformation pattern at 420°C
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Von Mises and lateral stress at the film center
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Maximum interface tensile stress
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Maximum interface shear stress
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Typical locally buckled laminate
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(a) Gap between copper and substrate. Different results for four cases of simulation complexity. (b) Loading parameter (=temperature) versus gap opening at the center. Different results for four cases of simulation complexity. (c) Temperature dependency of gap-mode shape in the y direction. (d) Temperature dependency of gap-mode shapes in the z direction.
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Effect of a temperature difference between copper and substrate. Gap-mode shape in the z direction.
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(a) Temperature dependency of gap-mode shape in the y direction. (b) Temperature dependency of gap-mode shapes in the z direction. (c) Loading parameter (=temperature) versus gap opening at the center. (d) Delaminated local mesh with σxx distribution: Interface tensile stresses included.
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(a) Gap between copper and substrate in the y direction (z=75 μm). (b) Gap between copper and substrate in the z direction (y=0). (c) Temperature dependency of gap-mode shapes in the y direction (z=75 μm). (d) Temperature dependency of gap-mode shapes in the z direction (y=0).
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FEM-model of a carrier problem with thin copper layers on a ceramic substrate
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Simplified configuration of thin copper layers on a ceramic substrate (+ definition of coordinate system)
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1D thin film buckling mode
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Interface (mean-) strength testing; (a) overall view, (b) enlarged view
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Microstructural view on ceramics surface
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Microstructural view showing the interphase

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