Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel; G. Q. Zhang; J. H. J. Janssen; L. J. Ernst

doi:10.1115/1.1604149

Journal of Electronic Packaging | Volume 125 | Issue 4 | TECHNICAL PAPERS

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TECHNICAL PAPERS

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen and L. J. Ernst

[+] Author and Article Information

W. D. van Driel

Philips Semiconductors, ATO Innovation, P.O. Box 30008, 6534 AE Nijmegen, The Netherlandse-mail: willem.van.driel@philips.com

G. Q. Zhang

Philips CFT, P.O. Box 218, 5600 MD Eindhoven, The Netherlandse-mail: g.q.zhang@philips.com

J. H. J. Janssen

Philips Semiconductors, ATO Innovation, P.O. Box 30008, 6534 AE Nijmegen, The Netherlands

L. J. Ernst

Delft University of Technology, P.O. Box 5033, 2600 GA Delft, The Netherlandse-mail: l.j.ernst@wbmt.tudelft.nl

J. Electron. Packag 125(4), 490-497 (Dec 15, 2003) (8 pages) doi:10.1115/1.1604149 History: Received November 01, 2002; Online December 15, 2003

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References

Figures

2D axisymmetric FE model for the package

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Temperature-dependent Young’s modulus and yield stress of the leadframe material

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Temperature-dependent Young’s modulus and CTE for the compound

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Temperature-dependent Young’s modulus and yield stress for the solder die-attach

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Horizontal stress along the top of the die surface from center to edge for nominal model and model with same length for die-leadframe after die attachment at 25°C

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Von Mises stress distribution in the leadframe after temperature cycling

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Effect of solder die-attach creep during temperature cycling: horizontal stress evolution at the mid-top and mid-bottom of the die

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Deformations at the top of a packed sample from center to edge due to cooldown

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Flow chart of the developed optimization strategy

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Simulated versus predicted stress: quadratic (left) and Kriging model (right)

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Example RSM plot; t_lf refers to leadframe thickness, t_solder to solder die-attach thickness

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3D RSM plot mid bottom die stresses at 25°C after die soldering

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3D RSM plot top mid die stresses after temperature cycling testing at 25°C

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3D RSM plot top mid die stresses after die soldering at 25°C

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Top die horizontal stress as a function of the assembly process for different leadframe thickness

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Bottom die horizontal stress as a function of the assembly process for different leadframe thickness

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van Driel WD, Zhang GQ, Janssen JJ, Ernst LJ. Response Surface Modeling for Nonlinear Packaging Stresses. ASME. J. Electron. Packag. 2003;125(4):490-497. doi:10.1115/1.1604149.

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Response Surface Modeling for Nonlinear Packaging Stresses

References

Figures

2D axisymmetric FE model for the package

Temperature-dependent Young’s modulus and yield stress of the leadframe material

Temperature-dependent Young’s modulus and CTE for the compound

Temperature-dependent Young’s modulus and yield stress for the solder die-attach

Major packaging process specification

Horizontal stress distribution after die attachment at 25°C

Horizontal stress distribution after molding at 170°C

Horizontal stress distribution after temperature cycling at −65°C

Horizontal stress along the top of the die surface from center to edge for nominal model and model with same length for die-leadframe after die attachment at 25°C

Von Mises stress distribution in the leadframe after temperature cycling

Effect of solder die-attach creep during temperature cycling: horizontal stress evolution at the mid-top and mid-bottom of the die

Deformations at the top of a packed sample from center to edge due to cooldown

Flow chart of the developed optimization strategy

Simulated versus predicted stress: quadratic (left) and Kriging model (right)

Example RSM plot; t_lf refers to leadframe thickness, t_solder to solder die-attach thickness

3D RSM plot mid bottom die stresses at 25°C after die soldering

3D RSM plot top mid die stresses after temperature cycling testing at 25°C

3D RSM plot top mid die stresses after die soldering at 25°C

Top die horizontal stress as a function of the assembly process for different leadframe thickness

Bottom die horizontal stress as a function of the assembly process for different leadframe thickness

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Errata

Discussions

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