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TECHNICAL PAPERS

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

[+] Author and Article Information
Reena Cole, Mark Davies, Jeff Punch

Stokes Research Institute, Mechanical and Aeronautical Engineering Dept., University of Limerick, Ireland

J. Electron. Packag 125(4), 480-489 (Dec 15, 2003) (10 pages) doi:10.1115/1.1604811 History: Received April 01, 2001; Revised June 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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References

Figures

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Thermal test PCB showing the positions of SuperBGA’s
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Side view and bottom view of SuperBGA® (all dimensions are in mm)
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Cutaway view of the SuperBGA® package 6
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Schematic of PIV system at outlet of medium sized wind tunnel
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Schematic of test vehicle at outlet of wind tunnel
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A composite picture of PIV measurements at an approach velocity of 0.5 m/s, ReL≈1028, predicted flat plate boundary layer growth is also shown
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A composite picture of PIV measurements at an approach velocity of 1 m/s, ReL≈2056, predicted flat plate boundary layer growth is also shown
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A composite picture of PIV measurements at an approach velocity of 2 m/s, ReL≈4112, predicted flat plate boundary layer growth is also shown
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A composite picture of PIV measurements at an approach velocity of 4 m/s, ReL≈8224, predicted flat plate boundary layer growth is also shown
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Velocity profile 144.8 mm from the PCB leading edge with flat plate predictions of δ, the boundary layer thickness, and measurement error bars shown on the 4-m/s curve
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Authors’ impression of secondary flow over a low profile pedestal
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Thermal resistance versus Reynolds number for varying power dissipation for case 1 on each PCB (enhanced radiation)
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Thermal resistance versus Reynolds number for case 1 for PCB’s with and without paint
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Thermal resistance versus Reynolds number in the streamwise direction (a) mid keff PCB, (b) high keff PCB
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Influence factors versus Reynolds numbers for component 4 for boards 2 and 3
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Thermal images of the mid and high effective conductivity PCB’s for cases 1 and 2. (a) Case 1, mid keff PCB, Re≈4100; (b) case 2, mid keff PCB, Re≈4100; (c) case 1, high keff PCB, Re≈4100; (d) case 2, high keff PCB, Re≈4100.

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