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TECHNICAL PAPERS

A Vapotron Effect Application for Electronic Equipment Cooling

[+] Author and Article Information
Giulio Lorenzini

Department of Agricultural Economics and Engineering, Alma Mater Studiorum, University of Bologna, Viale Fanin, 50-40127 Bologna, Italy

Cesare Biserni

Department of Energetic Nuclear and Environmental Control Engineering, Alma Mater Studiorum, University of Bologna, Viale Risorgimento, 2-40136 Bologna, Italye-mail: cesare.biserni@mail.ing.unibo.it

J. Electron. Packag 125(4), 475-479 (Dec 15, 2003) (5 pages) doi:10.1115/1.1615796 History: Received June 01, 2003; Online December 15, 2003
Copyright © 2003 by ASME
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References

Bar-Cohen, A. D., and Kraus, A., 1998, “Advances in Thermal Modeling of Electronic Components and Systems,” Vol. 4, ASME Press Series.
Steinberg, Dave S., 1980, Cooling Techniques for Electronic Equipment, John Wiley & Sons.
Ellison, Gordon N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand Reinhold Company.
Young,  J. T., and Vafai,  K., 1998, “Convective Flow and Heat Transfer in a Channel Containing Multiple Heated Obstacles,” Int. J. Heat Mass Transfer, 41, pp. 3279–3298.
Evans,  A. G., He,  M. Y., Hutchinson,  J. W., and Shaw,  M., 2001, “Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses,” ASME J. Electron. Packag., 123(3), Sept., pp. 211–217.
Culham,  J. R., Yovanovich,  M. M., Teertstra,  P., Wang,  C. S., Refai-Ahmed,  G., and Min Tain,  R., 2001, “Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape,” ASME J. Electron. Packag., 123(3), Sept., pp. 182–188.
Vargas,  J. V. C., Stanescu,  G., and Florea,  R., 2001, “A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages,” ASME J. Electron. Packag., 123(3), Sept., pp. 200–210.
Take,  K., and Webb,  R. L., 2001, “Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader,” ASME J. Electron. Packag., 123(3), Sept., pp. 189–195.
Beurtheret, C. A., 1961, “Les processus de Vaporisation et le Vapotron,” Journées de la Transmission de la Chaleur, Paris.
Cumo, M., 1994, “Subcooled Flow Boiling CHF at High Liquid Velocity,” ICHEME Symposium Series, No. 129, pp. 15–33.
Biserni, C., Lorenzini, G., and Orlandelli, C. M., 2001, “Frequency Analysis of the Vapotron Effect in Forced Convection: A Challenge for Numerical Description of Multiphase Flows,” First International Conference on Computational Methods in Multiphase Flow, MULTIPHASE FLOW 2001, Orlando, Florida, March, pp. 173–182, WIT Press.
Biserni,  C., and Lorenzini,  G., 2002, “Experimental Tests on Subcooled Boiling Heat Transfer Under Forced Convection Conditions,” Journal of Engineering Thermophysics,11(1), pp. 73–81.
Rohsenhow, W. M., and Hartnett, J. P., eds., 1985, Handbook of Heat Transfer Fundamentals, Ganic E.N.

Figures

Grahic Jump Location
Schematic representation of the cyclic nature of the Vapotron Effect
Grahic Jump Location
Configuration of the experimental set up
Grahic Jump Location
Electronic component to be cooled
Grahic Jump Location
Heat exchange coefficient temporal trend
Grahic Jump Location
Temperature trend of the coolant

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